Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests
Panchenko, Iuliana, Wenzel, Laura, Mueller, Maik, Rudolph, Catharina, Hanisch, Anke, Wolf, Juergen M.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
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Journal Article
Advanced Carriers on Legacy CMP Tools - an Intelligent Solution for Flexible Production Environments and R&D Labs
Franz, Mathias, Schubert, Ina, Junghans, Romy, Martinka, Ronny, Rudolph, Catharina, Wachsmuth, Holger, Trojan, Dan, VanDevender, Barrie, Wrschka, Peter, Gottfried, Knut Christoph
Published in ECS transactions (28.07.2016)
Published in ECS transactions (28.07.2016)
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Journal Article
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
Gao, Guilian, Mirkarimi, Laura, Workman, Thomas, Fountain, Gill, Theil, Jeremy, Guevara, Gabe, Liu, Ping, Lee, Bongsub, Mrozek, Pawel, Huynh, Michael, Rudolph, Catharina, Werner, Thomas, Hanisch, Anke
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
Wenzel, Laura, Rudolph, Catharina, Shehzad, Adil, Mukhopadhyay, Partha, Fulford, H. Jim, Junghaehnel, Manuela, Panchenko, Juliana
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Annealing Effects in Sub-8 μm Pitch Die-to-Wafer Hybrid Bonding
Mukhopadhyay, Partha, Wenzel, Laura, Rudolph, Catharina, Tuchman, Andrew, Ryan, Kevin, Gildea, Adam, Nichols, Chris, Allgair, John, Arkalgud, Sitaram, deVilliers, Anton, Fulford, Jim
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing
Panchenko, Iuliana, Wambera, Laura, Mueller, Maik, Rudolph, Catharina, Hanisch, Anke, Bartusseck, Irene, Wolf, M. J.
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Investigation of Wafer Dicing and Cleaning Processes for Die-to-die Oxide direct Bonding Technology
Khurana, Gaurav, Hanisch, Anke, Rudolph, Catharina, Meyer, Jorg, Wieland, Marcel, Panchenko, Iuliana
Published in 2021 44th International Spring Seminar on Electronics Technology (ISSE) (05.05.2021)
Published in 2021 44th International Spring Seminar on Electronics Technology (ISSE) (05.05.2021)
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Conference Proceeding
Challenges of TSV backside process integration
Rudolph, Catharina, Wachsmuth, Holger, Boettcher, Mathias, Steller, Wolfram, Wolf, M. Juergen
Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
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Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
Conference Proceeding
Bath chemistry and copper overburden as influencing factors of the TSV annealing
Saettler, P., Boettcher, M., Rudolph, Catharina, Wolter, K.-J
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Advanced Carriers on Legacy CMP Tools - an Intelligent Solution for Flexible Production Environments and R&D Labs
Gottfried, Knut Christoph, VanDevender, Barrie, Trojan, Dan, Feeney, Paul, Schubert, Ina, Junghans, Romy, Martinka, Ronny, Franz, Mathias, Rudolph, Catharina, Wachsmuth, Holger
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
Published in Meeting abstracts (Electrochemical Society) (01.04.2016)
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Journal Article
Method for monitoring chemical-mechanical polishing process
DRUMMER, HEIKE, THALDORF, CHRISTIAN, LOEBMANN, ANDRE, RUDOLPH, CATHARINA
Year of Publication 08.06.2006
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Year of Publication 08.06.2006
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