Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment
Umunnakwe, C. B., Zawra, I., Rudnyi, E. B., Niessner, M., Bechtold, T.
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics
Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T.
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications
Umunnakwe, C. B., Zawra, I., Yuan, C., Rudnyi, E. B., Hohlfeld, D., Niessner, M., Bechtold, T.
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Model order reduction in mechanical engineering
Lohmann, B, Bechtold, T, Eberhard, P, Fehr, J, Rixen, D. J, Cruz Varona, M, Lerch, C, Yuan, C. D, Rudnyi, E. B, Fröhlich, B, Holzwarth, P, Grunert, D, Meyer, C. H, Rutzmoser, J. B
Published in Applications (2020)
Published in Applications (2020)
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Book Chapter
Computationally efficient and stable order reduction method for a large-scale model of MEMS piezoelectric energy harvester
Kudryavtsev, M., Rudnyi, E. B., Bechtold, T., Korvink, J. G.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
System-level model of electrothermal microsystem with temperature control circuit
Bechtold, T, Rudnyi, E B, Hohlfeld, D
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Simultaneous Assessment of the YBa2Cu3O6+z Thermodynamics Under the Linear Error Model
Rudnyi, E. B., Kuzmenko, V. V., Voronin, G. F.
Published in Journal of physical and chemical reference data (01.09.1998)
Published in Journal of physical and chemical reference data (01.09.1998)
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Journal Article