Methodology for pad conditioning sweep optimization for advanced nodes
Khanna, Aniruddh J., Jawali, Puneet, Redfield, Daniel, Kakireddy, Raghava, Chockalingam, Ashwin, Benvegnu, Dominic, Yang, Mo, Rozo, Sebastian, Fung, Jason, Cornejo, Mario, Abramson, Igor, Yamamura, Mayu, Yuan, Zhibo, Bajaj, Rajeev
Published in Microelectronic engineering (15.08.2019)
Published in Microelectronic engineering (15.08.2019)
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개선된 기공 구조를 갖는 연마 패드들
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POLISHING PADS HAVING IMPROVED PORE STRUCTURE
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Year of Publication 24.11.2022
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POLISHING PADS HAVING IMPROVED PORE STRUCTURE
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Advances in Pad Conditioning for Enhancement of CMP Process Stability over Pad Life
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Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
Published in Meeting abstracts (Electrochemical Society) (01.05.2019)
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Polishing pads having improved pore structure
MADHUSOODHANAN, SUDHAKAR, SRIDHAR, UMA, PATIBANDLA, NAG B, LUO, YING-DONG, BAJAJ, RAJEEV, YAMAMURA, MAYU, REDFIELD, DANIEL, GANAPATHIAPPAN, SIVAPACKIA, CHOCKALINGAM, ASHWIN, ROZO, SEBASTIAN DAVID, NG, HOU T
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
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