Cyanate Ester-Based Encapsulation Material for High-Temperature Applications
Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo
Published in Journal of electronic materials (01.09.2013)
Published in Journal of electronic materials (01.09.2013)
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Journal Article
Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
Sharif, Ahmed, Lim, Jun zhang, Made, Riko I, Lau, Fu Long, Phua, Eric Jian Rong, Lim, Ju Dy, Wong, Chee Cheong, Gan, Chee Lip, Chen, Zhong
Published in Journal of electronic materials (01.08.2013)
Published in Journal of electronic materials (01.08.2013)
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Journal Article
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
Loeblein, Manuela, Tsang, Siu Hon, Pawlik, Matthieu, Phua, Eric Jian Rong, Yong, Han, Zhang, Xiao Wu, Gan, Chee Lip, Teo, Edwin Hang Tong
Published in ACS nano (28.02.2017)
Published in ACS nano (28.02.2017)
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Journal Article
Novel high temperature polymeric encapsulation material for extreme environment electronics packaging
Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
Published in Materials & design (05.03.2018)
Published in Materials & design (05.03.2018)
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Journal Article
Role of the ZnO electron transport layer in PbS colloidal quantum dot solar cell yield
Chiu, Arlene, Lu, Chengchangfeng, Kachman, Dana E, Rong, Eric, Chintapalli, Sreyas M, Lin, Yida, Khurgin, Daniel, Thon, Susanna M
Published in Nanoscale (02.05.2024)
Published in Nanoscale (02.05.2024)
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Journal Article
A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published in Journal of micromechanics and microengineering (01.09.2013)
Published in Journal of micromechanics and microengineering (01.09.2013)
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Journal Article
Improving PbS Colloidal Quantum Dot Solar Cell Performance via Solution-Phase Engineering
Gudi, Dhanvini, Chiu, Arlene, Kachman, Dana, Rong, Eric, Kamal, Serene, Lan, Yucheng, Thon, Susanna M.
Published in 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) (11.06.2023)
Published in 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) (11.06.2023)
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Conference Proceeding
New Chalcogenide-Based Hole Transport Materials for Colloidal Quantum Dot Photovoltaics
Rong, Eric, Chiu, Arlene, Bambini, Christianna, Lin, Yida, Lu, Chengchangfeng, Thon, Susanna M.
Published in 2021 IEEE 48th Photovoltaic Specialists Conference (PVSC) (20.06.2021)
Published in 2021 IEEE 48th Photovoltaic Specialists Conference (PVSC) (20.06.2021)
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Conference Proceeding
Improving the Performance and Yield of Colloidal Quantum Dot Solar Cells Through Electron Transport Layer Optimization
Kachman, Dana, Chiu, Arlene, Gudi, Dhanvini, Lu, Chengchangfeng, Rong, Eric, Chintapalli, Sreyas, Lin, Yida, Khurgin, Daniel, Thon, Susanna M.
Published in 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) (11.06.2023)
Published in 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) (11.06.2023)
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Conference Proceeding
New Hole Transport Materials via Stoichiometry-Tuning for Colloidal Quantum Dot Photovoltaics
Chiu, Arlene, Bambini, Christianna, Rong, Eric, Lin, Yida, Thon, Susanna M.
Published in 2020 47th IEEE Photovoltaic Specialists Conference (PVSC) (14.06.2020)
Published in 2020 47th IEEE Photovoltaic Specialists Conference (PVSC) (14.06.2020)
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Conference Proceeding
Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300°c/30kpsi) applications
Leong Ching Wai, Wen Wei Seit, Rong, Eric Phua Jian, Mian Zhi Ding, Rao, Vempati Srinivasa, MinWoo, Daniel Rhee
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Extreme high pressure and high temperature package development
Hwang How Yuan, Ching, Eva Wai Leong, Chan Yuen Sing, Chidambaram, Vivek, Lee Jong Bum, Rong, Eric Phua Jian, Gan Chee Lip, Woo, Daniel Rhee Min
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Behavior of Resorcinol based Phthalonitrile as High Temperature Encapsulant
Tay, Yu Shan, Phua, Jian Rong Eric, Gan, Chee Lip
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging
Lim, Song Kiat Jacob, Phua, Jian Rong Eric, Bai, Yu, Hu, Xiao, Gan, Chee Lip
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding