Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee, Daniel
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
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Journal Article
Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application
Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel
Published in Journal of electronic materials (01.07.2014)
Published in Journal of electronic materials (01.07.2014)
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Journal Article
Cyanate Ester-Based Encapsulation Material for High-Temperature Applications
Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo
Published in Journal of electronic materials (01.09.2013)
Published in Journal of electronic materials (01.09.2013)
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Journal Article
Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices
Gongyue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, Rhee, Daniel Min Woo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2016)
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Journal Article
Direct Patterning of Conductive Fine Line in Dielectric Layer for Semiconductor Package
Lee, Jung Shin, Cho, Jung Woo, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Woo Rhee, Daniel Min
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages
Hoe, Yen Yi Germaine, Yap Guan Jie, Rao, V. S., Rhee, M. W. Daniel
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Flow modeling of die attach process and the optimization of process parameters in advance packaging
Lin Ji, Leong Ching Wai, Rhee, M. W. D.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications
Sekhar, V. N., Lee Jong Bum, Shibata, Tomoaki, Kawamori, Takashi, Masuda, Katsuyuki, Woo, Daniel Rhee Min, Chen Bangtao, Yamamoto, Kazunori
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Characterization of thermally conductive underfill materials for high performance flip-chip applications
Chew, M., Mian Zhi Ding, Wai, E., Ser Choong Chong, Rao, V. S., Rhee, Min Woo Daniel
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Extreme high pressure and high temperature package development
Hwang How Yuan, Ching, Eva Wai Leong, Chan Yuen Sing, Chidambaram, Vivek, Lee Jong Bum, Rong, Eric Phua Jian, Gan Chee Lip, Woo, Daniel Rhee Min
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Cure Dependent Viscoelasticity with Heat Generation
Han, Min soo, Shin, Yongchul, Lim, Kyeongbin, Rhee, Daniel Min Woo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Novel Characterization Method of Chip Level Hybrid Bonding Strength
Kim, Juno, Lim, Kyeongbin, Hahn, Seung Ho, Lee, Mingu, Rhee, Daniel Min Woo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Numerical Study of Metal Ink Behavior on the Wettability Pattern for Conductive Line Inkjet-Printing with Lattice Boltzmann Approach
Lee, Jung Shin, Cho, Jung Woo, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Rhee, Daniel Min Woo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C
Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Lee Jong Bum, Zhang Hengyun
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding