Time-resolved qubit readout via nonlinear Josephson inductance
Reuther, Georg M, Zueco, David, Hänggi, Peter, Kohler, Sigmund
Published in New journal of physics (12.09.2011)
Published in New journal of physics (12.09.2011)
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Journal Article
Time-resolved measurement of a charge qubit
Reuther, Georg M, Zueco, David, Hänggi, Peter, Kohler, Sigmund
Published in Physical review letters (23.01.2009)
Published in Physical review letters (23.01.2009)
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Journal Article
Entanglement and disentanglement in circuit QED architectures
Zueco, David, Reuther, Georg M., Hänggi, Peter, Kohler, Sigmund
Published in Physica. E, Low-dimensional systems & nanostructures (2010)
Published in Physica. E, Low-dimensional systems & nanostructures (2010)
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Journal Article
Conference Proceeding
Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage
Udiljak, Dominik, Pufall, Reinhard, Reuther, Georg M., Boudaden, Jamila, Ramm, Peter, Schrag, Gabriele
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
A novel damage test evaluation of IC bond pad stack strength
Yeo, Alfred, Yong, Eric, Tong, Dan Swee, Reuther, Georg M.
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling
Reuther, Georg M., Pufall, Reinhard, Wunderle, Bernhard
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Udiljak, Dominik, Pufall, Reinhard, Wunderle, Bernhard
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Analytical and simulation-based risk assessment of imprint depth and brittle fracture in bond pad stacks
Reuther, Georg M., Penjovic, Ivan, Brezmes, Angel Ochoa, Pufall, Reinhard
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Conference Proceeding
Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Pufall, Reinhard, Wunderle, Bernhard
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
Pufall, Reinhard, May, Daniel, Wunderle, Bernhard, Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs
Pflugler, Nadine, Pufall, Reinhard, Goroll, Michael, Mahler, Joachim, Reuther, Georg M., Wunderle, Bernhard
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages
Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik, Pufall, Reinhard, Wunderle, Bernhard
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, Reinhard, Goroll, Michael, Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik, Dudek, Rainer
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Nonequilibrium phases in hybrid arrays with flux qubits and NV centers
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Paper
Journal Article
Monitoring Entanglement Evolution and Collective Quantum Dynamics
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Paper
Journal Article