Advanced Ti+Cu Seed Sputter Technologies for Glass Substrates with Through Glass Via and Through Cavities Glass as well as Low-K Polymer Laminated Glass Substrates
Rettenmeier, Roland, Zoberbier, Ralph, Carazzetti, Patrick, Singaram, Suresh, Low, Stanley
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Backside Metallization for Logic Applications
Rettenmeier, Roland, Carazzetti, Patrick, Strolz, Ewald, Zoberbier, Ralph, Low, Stanley, Singaram, Suresh Kumar
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond
Schein, Friedrich-Leonhard, Voigt, Christian, Gerhold, Lutz, Tsigaras, Ioannis, Elghazzali, Mohamed, Sawamoto, Hirofumi, Strolz, Ewald, Rettenmeier, Roland, Kahle, Ruben, Bottcher, Lars
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
Schein, Friedrich-Leonhard, Elghazzali, Mohammed, Voigt, Christian, Tsigaras, Ioannis, Sawamoto, Hirofumi, Strolz, Ewald, Rettenmeier, Roland, Bottcher, Lars
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding