Temperature dependence of the Al-fill processes for submicron-via structures
Weber, S.J, Iggulden, R.C, Schnabel, R.F, Weigand, P, Restaino, D.D, Brodsky, S.B, Mehter, E.A, Clevenger, L.A
Published in Thin solid films (04.05.1998)
Published in Thin solid films (04.05.1998)
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