Electrografted Copper Seed Layer for High Aspect Ratio TSVs Interposer Metallization
Gaillard, Frédéric, Religieux, Laurianne, Mourier, Thierry, Ribière, C, Vandroux, Laurent, Suhr, Dominique, Raynal, Frédéric, Mevellec, Vincent
Published in ECS transactions (07.04.2015)
Published in ECS transactions (07.04.2015)
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A Novel Bottom up Fill Mechanism for the Metallization of Advanced Node Copper Interconnects
Mevellec, Vincent, Thiam, Mikailou, Suhr, Dominique, Religieux, Laurianne, Blondeau, Paul, Chaumont, Jean-Baptiste, Raynal, Frederic
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
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Journal Article