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The failure mode study of the polymer ball interconnected IC package under board level thermal mechanical stress
Cheng-Chih Chen, Lee, Jeffrey, Lee, Dem, Lin, Alice
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2016)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2016)
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Conference Proceeding
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The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stress
Lee, Jeffrey ChangBing, Cheng-Chih Chen, Dem Lee, Lin, Alice
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding