Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling
Khatib, Mohamad El, Reitz, Sven, Warmuth, Jens
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Conference Proceeding
Failure Mechanism Detection Algorithm with MOSFET Body Diode
Khatib, Mohamad El, Reitz, Sven, Warmuth, Jens
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
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Conference Proceeding
System Level Modeling of Microsystems Using Order Reduction Methods
Reitz, S, Bastian, J, Haase, J, Schneider, P, Schwarz, P
Published in Analog integrated circuits and signal processing (01.10.2003)
Published in Analog integrated circuits and signal processing (01.10.2003)
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Journal Article
System Level Modeling of the Relevant Physical Effects of Inertial Sensors Using Order Reduction Methods
Reitz, Sven, Döring, Christian, Bastian, Jens, Schneider, Peter, Schwarz, Peter, Neul, Reinhard
Published in Analog integrated circuits and signal processing (01.08.2005)
Published in Analog integrated circuits and signal processing (01.08.2005)
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Journal Article
A flow for parasitics extraction in 3D-systems
Heinig, A., Dittrich, M., Reitz, S., Stolle, J.
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
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Conference Proceeding
An approach for systematic behavioral modeling of micro systems
Schneider, Peter, Reitz, Sven, Elst, Gunter, Wilde, Andreas
Published in 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2010)
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Published in 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2010)
Conference Proceeding
Simulation of electro-thermal interaction
Jancke, R, Wilde, A, Martin, R, Reitz, S, Schneider, P
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Modular modeling approach to consider RF and thermal behavior of complex systems built up using interconnect structures in 3D integration
Reitz, S, Stolle, J, Martin, R, Wilde, A, Schneider, P
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Integration of multi physics modeling of 3D stacks into modern 3D data structures
Schneider, P, Heinig, A, Fischbach, R, Lienig, J, Reitz, S, Stolle, Jörn, Wilde, A
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
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Conference Proceeding
Model based sensor system for temperature measurement in R744 air conditioning systems
Reitz, S., Schroth, A., Schneider, P.
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
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Conference Proceeding
Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures
Janczyk, G., Bieniek, T., Janus, P., Kociubinski, A., Grabiec, P., Szynka, J., Reitz, M.S., Schneider, P., Kaulfersch, E., Weber, J.
Published in 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems (01.06.2007)
Published in 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems (01.06.2007)
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Conference Proceeding