Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling
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Studies on the reliability of power packages based on strength and fracture criteria
Dudek, Rainer, Pufall, Reinhard, Seiler, Bettina, Michel, Bernd
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure
Goroll, Michael, Pufall, Reinhard, Aresu, Stefano, Gustin, Wolfgang
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design
Pflugler, Nadine, Breitenreiner, Sebastian, Pufall, Reinhard, Wunderle, Bernhard
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices
Goroll, Michael, Kanert, Werner, Pufall, Reinhard, Aresu, Stefano
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion
Sebastian, Breitenreiner, Nadine, Pflugler, Reinhard, Pufall, Bernhard, Wunderle
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Investigation of chip-package interaction-looking for more acceleration in product qualification tests
Kanert, W., Pufall, R.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage
Udiljak, Dominik, Pufall, Reinhard, Reuther, Georg M., Boudaden, Jamila, Ramm, Peter, Schrag, Gabriele
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
In-Situ Degradation Monitoring of Sputtered Thin Al Films on Si Cantilevers Inside SEM During Accelerated Stress Testing using Nano-Indenter Actuation and Vibration Loading
Johrmann, Nathanael, Osipova, Valentina, Breitenreiner, Sebastian, Pufall, Reinhard, Wunderle, Bernhard
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
Published in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (23.09.2021)
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Conference Proceeding
Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling
Reuther, Georg M., Pufall, Reinhard, Wunderle, Bernhard
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Semiconductors in high temperature applications – a future trend in automotive industry
GOROLL, Michael, PUFALL, Reinhard, KANERT, Werner, PLIKAT, Boris
Published in Microelectronics and reliability (01.09.2004)
Published in Microelectronics and reliability (01.09.2004)
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Conference Proceeding
Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Udiljak, Dominik, Pufall, Reinhard, Wunderle, Bernhard
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Analytical and simulation-based risk assessment of imprint depth and brittle fracture in bond pad stacks
Reuther, Georg M., Penjovic, Ivan, Brezmes, Angel Ochoa, Pufall, Reinhard
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Conference Proceeding
Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Pufall, Reinhard, Wunderle, Bernhard
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
Pufall, Reinhard, May, Daniel, Wunderle, Bernhard, Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs
Pflugler, Nadine, Pufall, Reinhard, Goroll, Michael, Mahler, Joachim, Reuther, Georg M., Wunderle, Bernhard
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Non-destructive die attach test method for future robust packages - a proposal
Pflugler, Nadine, Pufall, Reinhard, Goroll, Michael, Wunderle, Bernhard
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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