Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing
Jacob, Peter, Thiemann, Uwe, Reiner, Joachim C.
Published in Microelectronics and reliability (01.07.2005)
Published in Microelectronics and reliability (01.07.2005)
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Journal Article
Gallium Artefacts on FIB-milled Silicon Samples
REINER, Joachim C, NELLEN, Philipp, SENNHAUSER, Urs
Published in Microelectronics and reliability (01.09.2004)
Published in Microelectronics and reliability (01.09.2004)
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Journal Article
Conference Proceeding
Effect of in situ ultrasonic treatment on tungsten surface oxidation
Romanyuk, Andriy, Oelhafen, Peter, Steiner, Roland, Nellen, Philip M., Reiner, Joachim C., Melnik, Viktor
Published in Surface science (05.12.2005)
Published in Surface science (05.12.2005)
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Journal Article
Impact of ESD-induced soft drain junction damage on CMOS product lifetime
Reiner, Joachim C., Keller, Thomas, Jäggi, Hans, Mira, Silvio
Published in Microelectronics and reliability (01.08.2000)
Published in Microelectronics and reliability (01.08.2000)
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Journal Article
Wafer mapping of ESD performance
Reiner, Joachim C., Schröder, Hans-Ulrich, Bender, Manfred
Published in Microelectronics and reliability (1999)
Published in Microelectronics and reliability (1999)
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Journal Article
Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown
Reiner, Joachim C., Gasser, Philippe, Sennhauser, Urs
Published in Microelectronics and reliability (01.09.2002)
Published in Microelectronics and reliability (01.09.2002)
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Journal Article
Pseudo-progressive breakdown of ultra-thin nitrided gate oxide
Reiner, J.C.
Published in IEEE International Integrated Reliability Workshop Final Report, 2004 (2004)
Published in IEEE International Integrated Reliability Workshop Final Report, 2004 (2004)
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Conference Proceeding