3D Packaging Challenges for High-End Applications
Agarwal, Rahul, Kannan, Sukeshwar, England, Luke, Reed, Rick, Yong Song, WangGu Lee, SangHyoun Lee, JinKun Yoo
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
2.5D packaging solution - From concept to platform qualification
Oswald, Jens, Goetze, Christian, Shan Gao, ShunQiang Gong, Juan Boon Tan, Reed, Rick, YoungRae Kim
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding