Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content
Pettersen, Sigurd R., Redford, Keith, Njagi, John, Kristiansen, Helge, Helland, Susanne, Kalland, Erik, Goia, Dan V., Zhang, Zhiliang, He, Jianying
Published in Journal of electronic materials (01.07.2017)
Published in Journal of electronic materials (01.07.2017)
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Journal Article
Deposition of continuous nickel shells on polymer microspheres
Halaciuga, Ionel, Njagi, John I., Redford, Keith, Goia, Dan V.
Published in Journal of colloid and interface science (01.10.2012)
Published in Journal of colloid and interface science (01.10.2012)
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Journal Article
METHOD OF APPLYING A CONDUCTIVE ADHESIVE
HELLAND TORE, GAKKESTAD JAKOB, OPLAND OTTAR, KRISTIANSEN HELGE, REDFORD KEITH
Year of Publication 25.08.2015
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Year of Publication 25.08.2015
Patent
Anodising as pre-treatment for structural bonding
Bjørgum, Astrid, Lapique, Fabrice, Walmsley, John, Redford, Keith
Published in International journal of adhesion and adhesives (2003)
Published in International journal of adhesion and adhesives (2003)
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Journal Article
Molecular structure and shear rheology of long chain branched polypropylene formed by light cross-linking of a linear precursor with 1,3-benzenedisulfonyl azide
Jørgensen, Jens Kjær, Redford, Keith, Ommundsen, Espen, Stori, Aage
Published in Journal of applied polymer science (15.10.2007)
Published in Journal of applied polymer science (15.10.2007)
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Journal Article