Microstructure and reliability of copper interconnects
Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Haebum Lee, Nogami, T., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.
Published in IEEE transactions on electron devices (01.06.1999)
Published in IEEE transactions on electron devices (01.06.1999)
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Journal Article
Barrier-first integration for improved reliability in copper dual damascene interconnects
Alers, G.B., Rozbicki, R.T., Harm, G.J., Kailasam, S.K., Ray, G.W., Danek, M.
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
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Conference Proceeding
Interlevel dielectric failures in copper/low-k structures
Alers, G.B., Jow, K., Shaviv, R., Kooi, G., Ray, G.W.
Published in IEEE transactions on device and materials reliability (01.06.2004)
Published in IEEE transactions on device and materials reliability (01.06.2004)
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Magazine Article
Trade-off between reliability and post-CMP defects during recrystallization anneal for copper damascene interconnects
Alers, G.B., Dornisch, D., Siri, J., Kattige, K., Tam, L., Broadbent, E., Ray, G.W.
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
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Conference Proceeding
TDDB and voltage-ramp reliability of SiC-base dielectric diffusion barriers in Cu/low-k interconnects
Jow, K., Alers, G.B., Sanganeria, M., Harm, G., Fu, H., Tang, X., Kooi, G., Ray, G.W., Danek, M.
Published in 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual (2003)
Published in 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual (2003)
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Conference Proceeding
Microencapsulation of antimicrobial ceftiofur drugs
Bodmeier, R, Chen, H, Davidson, R G, Hardee, G E
Published in Pharmaceutical development and technology (1997)
Published in Pharmaceutical development and technology (1997)
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Journal Article
Advanced 'contact engineering' for submicron VLSI multilevel metallization
Young, K.K., Riley, P.E., Uesato, W., Whetten, T.J., Hu, H.K., Ray, G.W., Peng, S., Chiu, K.-Y.
Published in IEEE transactions on semiconductor manufacturing (01.02.1993)
Published in IEEE transactions on semiconductor manufacturing (01.02.1993)
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Journal Article
Process integration of a direct-on-metal, non-etchback, /spl kappa/=2.5 spin-on polymer for the 0.18 /spl mu/m CMOS technology node
Sum, J.C., Ray, G.W., Ma, S., Kavari, R., MacInnes, L.M., Treadwell, C.A., Dunne, J., Hacker, N.P., Figge, L.K., Hendricks, N.
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
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Conference Proceeding