Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd
Published in Microelectronics and reliability (01.10.2016)
Published in Microelectronics and reliability (01.10.2016)
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Journal Article
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Ramli, M.I.I., Mohd Salleh, M.A.A., Derman, M.N., Said, R.M., Saud, N.
Published in MATEC Web of Conferences (01.01.2016)
Published in MATEC Web of Conferences (01.01.2016)
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Journal Article
Conference Proceeding
The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy
Chang, M.S., Salleh, M.A.A. Mohd, Halin, D.S.C., Ramli, M.I.I., Yasuda, H., Nogita, K.
Published in Journal of alloys and compounds (15.03.2022)
Published in Journal of alloys and compounds (15.03.2022)
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Journal Article
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd
Published in Microelectronics and reliability (01.10.2016)
Published in Microelectronics and reliability (01.10.2016)
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Journal Article
Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg
Tan, C.Y., Salleh, M.A.A. Mohd, Tan, X.F., Yasuda, H., Saud, N., Ramli, M.I.I., Nogita, K.
Published in Materials today communications (01.06.2022)
Published in Materials today communications (01.06.2022)
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Journal Article