Time-independent elastic–plastic behaviour of solder materials
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Stress analyses of high spatial resolution on TSV and BEoL structures
Vogel, D., Auerswald, E., Auersperg, J., Bayat, P., Rodriguez, R.D., Zahn, D.R.T., Rzepka, S., Michel, B.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J., Dudek, R., Jordan, R., Bochow-Neß, O., Rzepka, S., Michel, B.
Published in Microelectronics and reliability (01.06.2014)
Published in Microelectronics and reliability (01.06.2014)
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Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mroßko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.
Published in Microelectronics and reliability (01.06.2014)
Published in Microelectronics and reliability (01.06.2014)
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Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J., Mrossko, R., Dobrinski, H., Stürmann, J., Döring, R., Dudek, R., Rzepka, S., Michel, B.
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Condition monitoring indicators for Si and SiC power modules
Di Nuzzo, G., Tuellmann, M., Methfessel, T., Rzepka, S.
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
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Determining adhesion of critical interfaces in microelectronics - a reverse Finite Element Modelling approach based on nanoindentation - Part I
Reuther, G.M., Albrecht, J., Pufall, R., Dudek, R., Rzepka, S.
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Scheiter, L., Zhang, M., Ortmann, R. W.
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Gunther, M., Haag, M.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D., Auerswald, E., Gadhiya, Gh, Rzepka, S.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Geriatric trauma hospitalization in the United States: A population-based study
Rzepka, Susan G, Malangoni, Mark A, Rimm, Alfred A
Published in Journal of clinical epidemiology (01.06.2001)
Published in Journal of clinical epidemiology (01.06.2001)
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Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB — A numerical and experimental study
Schacht, R., Punch, J., Merten, E., Rzepka, S., Michel, B.
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
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FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J., Breuer, D., Machani, K. V., Rzepka, S., Michel, B.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J., Reuther, G. M., Brueckner, J., Auersperg, J., Rzepka, S., Pufall, R.
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding
Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F., Rost, F., Rezaie-Adli, A., Jansen, K. M. B., Wunderle, B., Keller, J., Rzepka, S., Michel, B.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification
Merten, E., von Essen, T., Luczack, F., Otto, A., Lunding, A., Lurkens, P., Bast, M., Abo Ras, M., Rzepka, S.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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