Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
Ryu, Suk-Kyu, Zhao, Qiu, Hecker, Michael, Son, Ho-Young, Byun, Kwang-Yoo, Im, Jay, Ho, Paul S., Huang, Rui
Published in Journal of applied physics (15.03.2012)
Published in Journal of applied physics (15.03.2012)
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Journal Article
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
Jiang, Tengfei, Ryu, Suk-Kyu, Zhao, Qiu, Im, Jay, Huang, Rui, Ho, Paul S.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
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Journal Article
A highly efficient 3D micromixer using soft PDMS bonding
Cha, Junghun, Kim, Jinseok, Ryu, Suk-Kyu, Park, Jungyul, Jeong, Yongwon, Park, Sewan, Park, Sukho, Kim, Hyeon Cheol, Chun, Kukjin
Published in Journal of micromechanics and microengineering (01.09.2006)
Published in Journal of micromechanics and microengineering (01.09.2006)
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Journal Article
A three-dimensional model of fluid–structural interactions for quantifying the contractile force for cardiomyocytes on hybrid biopolymer microcantilever
Park, Jungyul, Ryu, Suk-Kyu, Kim, Jinseok, Cha, Junghun, Baek, Jeongeun, Park, Sukho, Kim, Byungkyu, Lee, Sang Ho
Published in Journal of biomechanics (01.01.2007)
Published in Journal of biomechanics (01.01.2007)
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Journal Article
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
Lu, K.H., Xuefeng Zhang, Suk-Kyu Ryu, Im, J., Rui Huang, Ho, P.S.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Thermal stress induced delamination of through silicon vias in 3-D interconnects
Lu, Kuan H, Suk-Kyu Ryu, Qiu Zhao, Xuefeng Zhang, Im, Jay, Rui Huang, Ho, Paul S
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 23.01.2024
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Year of Publication 23.01.2024
Patent
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 31.03.2023
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Year of Publication 31.03.2023
Patent
Thermomechanical reliability of through-silicon vias in 3D interconnects
Kuan-Hsun Lu, Suk-Kyu Ryu, Im, Jay, Rui Huang, Ho, Paul S
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 04.10.2022
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Year of Publication 04.10.2022
Patent
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 13.09.2021
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Year of Publication 13.09.2021
Patent
스케일러블 시스템을 구현하기 위한 시스템들 및 방법들
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 26.10.2020
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Year of Publication 26.10.2020
Patent
Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures
Tengfei Jiang, Suk-Kyu Ryu, Im, Jay, Ho-Young Son, Nam-Seog Kim, Rui Huang, Ho, Paul S.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs
Mitra, J., Moongon Jung, Suk-Kyu Ryu, Rui Huang, Sung-Kyu Lim, Pan, D. Z.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis
Lu, K. H., Suk-Kyu Ryu, Qiu Zhao, Hummler, K., Im, J., Rui Huang, Ho, P. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Im, Jay, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Ho, P. S.
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
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Conference Proceeding
Measurement and analysis of thermal stresses in 3-D integrated structures containing through-silicon-vias
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Im, J., Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Ho, P. S.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Realistic computational modeling for hybrid biopolymer microcantilevers
Kim, Jinseok, Park, Jungyul, Ryu, Suk-Kyu, Baek, Jeongeun, Park, Sewan, Kim, Hyeon Cheol, Chun, Kukjin, Park, Sukho
Published in 2006 International Conference of the IEEE Engineering in Medicine and Biology Society (2006)
Published in 2006 International Conference of the IEEE Engineering in Medicine and Biology Society (2006)
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Conference Proceeding
Journal Article