Gepacktes integriertes Schaltkreisbauelement und Verfahren zu seiner Herstellung
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Year of Publication 29.12.2005
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Year of Publication 29.12.2005
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Ball grid array package
JUM SOOK PARK, TAE SUNG JEONG, KI TAE RYU, KEUN HYOUNG CHOI, HAN SHIN YOUN, TAE KEUN LEE
Year of Publication 13.11.2002
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Year of Publication 13.11.2002
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IC device with a metal thermal conductive layer having an opening for evacuating air
JUM SOOK PARK, TAE SUNG JEONG, KI TAE RYU, KEUN HYOUNG CHOI, HAN SHIN YOUN, TAE KEUN LEE
Year of Publication 02.10.2002
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Year of Publication 02.10.2002
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Ball grid array package
JUM SOOK PARK, TAE SUNG JEONG, KI TAE RYU, KEUN HYOUNG CHOI, HAN SHIN YOUN, TAE KEUN LEE
Year of Publication 11.09.2002
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Year of Publication 11.09.2002
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Ball grid array package having an integrated circuit chip
YOUN, HAN-SHIN, RYU, KI-TAE, JEONG, TAE-SUNG, LEE, TAE-KEUN, CHOI, KEUN-HYOUNG
Year of Publication 11.08.2001
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Year of Publication 11.08.2001
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