Thermal Aging of Technical Hard Gold Electrodeposits
Kurtz, Olaf, Barthelmes, Jurgen, Ruther, Robert, Danker, Michael, Lagorce-Broc, Florence, Bozsa, Felix, Brookes, David
Published in Metal finishing (01.07.2011)
Published in Metal finishing (01.07.2011)
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Journal Article
METHOD FOR IMPROVING THE ADHESION BETWEEN SILVER SURFACES AND RESIN MATERIALS
MENZEL NADINE, RUTHER ROBERT, WUNDERLICH CHRISTIAN, BARTHELMES JURGEN, KOK SIA WING
Year of Publication 29.06.2011
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Year of Publication 29.06.2011
Patent
Big grain and flat morphology—A new tin electrolyte for minimal whiskering and excellent solderability
Kurtz, Olaf, Barthelmes, Jürgen, Kühlkamp, Peter, Ruther, Robert, Neoh, Ding-Ghee
Published in Metal finishing (01.03.2010)
Published in Metal finishing (01.03.2010)
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Journal Article
A METHOD OF DEPOSITING A TIN LAYER ON A METAL SUBSTRATE AND A USE OF A STRUCTURE COMPRISING A NICKEL/PHOSPHOROUS ALLOY UNDERLAYER AND SAID TIN LAYER WITH SAID METHOD
CHEEOW TAN, ROBERT RUTHER, JURGEN BARTHELMES, OLAF KURTZ, JEN JOO LIM, DIN-GHEE NEOH
Year of Publication 01.09.2022
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Year of Publication 01.09.2022
Patent
Code reader with extended read range
NUNNINK LAURENS, RUTHER ROBERT, FERNANDEZ-DORADO PEPE, SANZ RODRIGUEZ SAUL
Year of Publication 05.11.2021
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Year of Publication 05.11.2021
Patent
Method for depositing thick copper layers onto sintered materials
DAMBROWSKY NINA, MCNELLY ANTHONY, RUTHER ROBERT, GENTH HERKO, GLOEDEN MARKUS
Year of Publication 23.12.2015
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Year of Publication 23.12.2015
Patent
Gold post-dip to improve corrosion-resistance properties
Kurtz, Olaf, Barthelmes, Jürgen, Lagorce-Broc, Florence, Bilkay, Taybet, Danker, Michael, Rüther, Robert
Published in Metal finishing (01.06.2009)
Published in Metal finishing (01.06.2009)
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Journal Article
Innovative tin electrolyte combining high technical standards with significant cost saving potentials
Kurtz, O., Kuhlkamp, P., Barthelmes, J., Ruther, R., Din-Ghee Neoh, Sia-Wing Kok
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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