Manufacturable CoWP metal cap process for copper interconnects
CANAPERI, DONALD F, FLUEGEL, JAMES E, RUBINO, JUDITH M, RESTAINO, DARRYL D, KRISHNAN, MAHADEVAIYER, SMITH, SEAN P.E, HENRY, RICHARD O
Year of Publication 16.07.2006
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Year of Publication 16.07.2006
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Electroplated CoWP composite structures as copper barrier layers
CHIRAS, STEFANIE R, RUBINO, JUDITH M, COOPER, EMANUEL ISRAEL, CABRAL, JR, KELLOCK, ANDREW, DELIGIANNI, HARIKLIA, TSAI, ROGER Y
Year of Publication 16.07.2005
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Year of Publication 16.07.2005
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Copper recess process with application to selective capping and electroless plating
DAVIS, KENNETH M, DALTON, TIMOTHY J, SAENGER, KATHERINE L, MALHOTRA, SANDRA G, TSENG, WEI-TSU, JAMIN, FEN F, KALDOR, STEFFEN K, SMITH, SEAN P.E, HU, CHAO-KUN, NARAYAN, CHANDRASEKHAR, RUBINO, JUDITH M, KRISHNAN, MAHADEVAIYER, LOFARO, MICHAEL F, CHEN, SHYNG-TSONG, RATH, DAVID L, KUMAR, KAUSHIK, SIMON, ANDREW H
Year of Publication 16.10.2004
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Year of Publication 16.10.2004
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