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Year of Publication 22.06.2006
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Method for testing chips on flat solder bumps
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Year of Publication 02.12.2003
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Method for testing chips on flat solder bumps
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Year of Publication 07.08.2007
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Electroplated CoWP composite structures as copper barrier layers
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Year of Publication 01.10.2002
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Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
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Year of Publication 01.10.2002
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Method for preparing a conductive pad for electrical connection and conductive pad formed
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