On the Dual Basis for Solving Electromagnetic Surface Integral Equations
Mei Song Tong, Weng Cho Chew, Rubin, B.J., Morsey, J.D., Lijun Jiang
Published in IEEE transactions on antennas and propagation (01.10.2009)
Published in IEEE transactions on antennas and propagation (01.10.2009)
Get full text
Journal Article
Study of meander line delay in circuit boards
Rubin, B.J., Singh, B.
Published in IEEE transactions on microwave theory and techniques (01.09.2000)
Published in IEEE transactions on microwave theory and techniques (01.09.2000)
Get full text
Journal Article
A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis
Kopcsay, G.V., Krauter, B., Widiger, D., Deutsch, A., Rubin, B.J., Smith, H.H.
Published in IEEE transactions on very large scale integration (VLSI) systems (01.12.2002)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.12.2002)
Get full text
Journal Article
The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM
Morsey, J., Deutsch, A., Libous, J.P., Surovic, C., Rubin, B.J., Lijun Jiang, Eisenberg, L.
Published in IEEE transactions on advanced packaging (01.05.2007)
Published in IEEE transactions on advanced packaging (01.05.2007)
Get full text
Journal Article
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
Chuan Xu, Lijun Jiang, Kolluri, S.K., Rubin, B.J., Deutsch, A., Smith, H., Banerjee, K.
Published in 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers (01.11.2009)
Published in 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers (01.11.2009)
Get full text
Conference Proceeding
A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures
Lijun Jiang, Chuan Xu, Rubin, B J, Weger, A J, Deutsch, A, Smith, H, Caron, A, Banerjee, K
Published in IEEE transactions on advanced packaging (01.11.2010)
Published in IEEE transactions on advanced packaging (01.11.2010)
Get full text
Journal Article
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
DEUTSCH, Alina, WINKEL, Thomas-Michael, KOPCSAY, Gerard V, SUROVIC, Christopher W, RUBIN, Barry J, KATOPIS, George A, CHAMBERLIN, Bruce J, KRABBENHOFT, Roger S
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
Get full text
Conference Proceeding
When are transmission-line effects important for on-chip interconnections?
Deutsch, A., Kopcsay, G.V., Restle, P.J., Smith, H.H., Katopis, G., Becker, W.D., Coteus, P.W., Surovic, C.W., Rubin, B.J., Dunne, R.P., Gallo, T., Jenkins, K.A., Terman, L.M., Dennard, R.H., Sai-Halasz, G.A., Krauter, B.L., Knebel, D.R.
Published in IEEE transactions on microwave theory and techniques (01.10.1997)
Published in IEEE transactions on microwave theory and techniques (01.10.1997)
Get full text
Journal Article
New methodology for combined Simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
Deutsch, A., Smith, H.H., Rubin, B.J., Krauter, B.L., Kopcsay, G.V.
Published in IEEE transactions on advanced packaging (01.02.2006)
Published in IEEE transactions on advanced packaging (01.02.2006)
Get full text
Journal Article
A CAD methodology and tool for the characterization of wide on-chip buses
Elfadel, I.M., Deutsch, A., Kopcsay, G.V., Rubin, B.J., Smith, H.H.
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
Get full text
Journal Article
Conference Proceeding
A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
Elfadel, I.M., Deutsch, A., Smith, H.H., Rubin, B.J., Kopcsay, G.V.
Published in IEEE transactions on advanced packaging (01.02.2004)
Published in IEEE transactions on advanced packaging (01.02.2004)
Get full text
Journal Article
Conference Proceeding
IBM Intelligent Bricks project—Petabytes and beyond
Wilcke, W. W., Garner, R. B., Fleiner, C., Freitas, R. F., Golding, R. A., Glider, J. S., Kenchammana-Hosekote, D. R., Hafner, J. L., Mohiuddin, K. M., Rao, KK, Becker-Szendy, R. A., Wong, T. M., Zaki, O. A., Hernandez, M., Fernandez, K. R., Huels, H., Lenk, H., Smolin, K., Ries, M., Goettert, C., Picunko, T., Rubin, B. J., Kahn, H., Loo, T.
Published in IBM journal of research and development (01.03.2006)
Published in IBM journal of research and development (01.03.2006)
Get full text
Journal Article
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Jianyong Xie, Daehyun Chung, Swaminathan, M., Mcallister, M., Deutsch, A., Lijun Jiang, Rubin, B.J.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Get full text
Conference Proceeding