Failures of Ag Wire Bonding ICs in Real-world Applications
Chen, Xuanlong, Xie, Xiaping, Wang, Min, Ruan, Yongjia, Liu, Tianhan, Shi, Lin
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
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Conference Proceeding
Electronic component defect positioning method and storage medium
LIAO WENYUAN, HUANG YUN, LI SHUWANG, YANG SHAOHUA, RUAN YONGJIA, CHEN XUANLONG, LAI CANXIONG, LU GUOGUANG
Year of Publication 09.03.2021
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Year of Publication 09.03.2021
Patent