패키지 기판에 내장된 보호 링을 갖는 자성 코어 인덕터를 포함하는 집적형 디바이스 패키지
SHENOY RAVINDRA, ERTURK METE, KIDWELL DONALD WILLIAM JR, ROUHANA LAYAL
Year of Publication 23.08.2017
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Year of Publication 23.08.2017
Patent
Improvement of substrate and package warpage by copper plating process optimization
Bchir, Omar, Jomaa, Houssam, Chin Kwan Kim, Rouhana, Layal, Kuiwon Kang, Shah, Milind, Bezuk, Steve
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding