Search Results - "ROUHANA, Layal" :: K.UTB vyhledávací portál

Adsorption of Short-Chain Thiols and Disulfides onto Gold under Defined Mass Transport Conditions: Coverage, Kinetics, and Mechanism

by Rouhana, Layal L, Moussallem, Maroun D, Schlenoff, Joseph B
Published in Journal of the American Chemical Society (12.10.2011)

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Aggregation-Resistant Water-Soluble Gold Nanoparticles

by Rouhana, Layal L., Jaber, Jad A., Schlenoff, Joseph B.
Published in Langmuir (18.12.2007)

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Aggregation resistant zwitterated superparamagnetic nanoparticles

by Rouhana, Layal L., Schlenoff, Joseph B.
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01.05.2012)

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패키지 기판에 내장된 보호 링을 갖는 자성 코어 인덕터를 포함하는 집적형 디바이스 패키지

by SHENOY RAVINDRA, ERTURK METE, KIDWELL DONALD WILLIAM JR, ROUHANA LAYAL
Year of Publication 23.08.2017

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INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE

by KIDWELL, Donald William, Jr, ERTURK, Mete, SHENOY, Ravindra, ROUHANA, Layal
Year of Publication 13.01.2021

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FINE PITCH AND SPACING INTERCONNECTS WITH RESERVE INTERCONNECT PORTION

by KANG, Kuiwon, ROUHANA, Layal, JOMAA, Houssam
Year of Publication 07.03.2019

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FINE PITCH AND SPACING INTERCONNECTS WITH RESERVE INTERCONNECT PORTION

by Jomaa, Houssam, Kang, Kuiwon, Rouhana, Layal
Year of Publication 28.02.2019

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Low profile integrated package

by Jomaa, Houssam, Kang, Kuiwon, Bahr, Christopher, Rouhana, Layal
Year of Publication 12.05.2020

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Integrated circuit (IC) package and package substrate comprising stacked vias

by Jomaa, Houssam, Kang, Kuiwon, Choi, Seongryul, Rouhana, Layal
Year of Publication 18.12.2018

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INTEGRATED CIRCUIT (IC) PACKAGE AND PACKAGE SUBSTRATE COMPRISING STACKED VIAS

by KANG, Kuiwon, ROUHANA, Layal, JOMAA, Houssam, CHOI, Seongryul
Year of Publication 08.11.2018

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INTEGRATED CIRCUIT (IC) PACKAGE AND PACKAGE SUBSTRATE COMPRISING STACKED VIAS

by KANG, Kuiwon, ROUHANA, Layal, JOMAA, Houssam, CHOI, Seongryul
Year of Publication 08.11.2018

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LOW PROFILE INTEGRATED PACKAGE

by KANG, Kuiwon, BAHR, Christopher, ROUHANA, Layal, JOMAA, Houssam
Year of Publication 27.09.2018

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LOW PROFILE INTEGRATED PACKAGE

by KANG, Kuiwon, BAHR, Christopher, ROUHANA, Layal, JOMAA, Houssam
Year of Publication 20.09.2018

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INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE

by KIDWELL, Donald William, Jr, ERTURK, Mete, SHENOY, Ravindra, ROUHANA, Layal
Year of Publication 13.12.2017

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INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE

by KIDWELL, Donald William, Jr, ERTURK, Mete, SHENOY, Ravindra, ROUHANA, Layal
Year of Publication 30.08.2017

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Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate

by Erturk Mete, Kidwell, Jr. Donald William, Shenoy Ravindra, Rouhana Layal
Year of Publication 15.11.2016

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Improvement of substrate and package warpage by copper plating process optimization

by Bchir, Omar, Jomaa, Houssam, Chin Kwan Kim, Rouhana, Layal, Kuiwon Kang, Shah, Milind, Bezuk, Steve
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)

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Conference Proceeding