Molded packaging for wide band gap semiconductor devices
Manatad, Romel N, Almagro, Erwin Ian Vamenta, Dosdos, Bigildis, Quinones, Maria Clemens Ypil, Teysseyre, Jerome
Year of Publication 10.09.2024
Get full text
Year of Publication 10.09.2024
Patent
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
TEYSSEYRE, Jerome, DOSDOS, Bigildis, MANATAD, Romel N, QUINONES, Maria Clemens Ypil, ALMAGRO, Erwin Ian Vamenta
Year of Publication 28.07.2022
Get full text
Year of Publication 28.07.2022
Patent