Search Results - "ROKUGAWA AKIO" :: K.UTB vyhledávací portál

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Semiconductor package and method of production thereof

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 02.12.2004

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Multilayered substrate for semiconductor device and method of manufacturing same

by Rokugawa, Akio, Sasaki, Masayuki, Matsuda, Yuichi
Year of Publication 27.07.2010

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Multilayered substrate for semiconductor device and method of manufacturing same

by MATSUDA YUICHI, ROKUGAWA AKIO, SASAKI MASAYUKI
Year of Publication 27.07.2010

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Substrate fabrication method and substrate

by ROKUGAWA AKIO, YAMASAKI TOMOO
Year of Publication 16.09.2004

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Substrate fabrication method and substrate

by Yamasaki, Tomoo, Rokugawa, Akio
Year of Publication 16.09.2004

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Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device

by ROKUGAWA AKIO, YAMASAKI TOMOO
Year of Publication 26.08.2004

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Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device

by Yamasaki, Tomoo, Rokugawa, Akio
Year of Publication 26.08.2004

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Multilayered circuit substrate, semiconductor device and method of producing same

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 24.07.2003

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Multilayered circuit substrate, semiconductor device and method of producing same

by Iijima, Takahiro, Rokugawa, Akio
Year of Publication 24.07.2003

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Semiconductor device and its manufacture method

by KOBAYASHI YASUSHI, ROKUGAWA AKIO, TANAKA MASATO, KANKI TSUYOSHI, KISHII SADAHIRO, NAKATA YOSHIHIRO
Year of Publication 29.07.2014

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Semiconductor device package and method of production and semiconductor device of same

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 26.06.2003

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Semiconductor device package and method of production and semiconductor device of same

by Iijima, Takahiro, Rokugawa, Akio
Year of Publication 26.06.2003

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Semiconductor package and method of production thereof

by Iijima, Takahiro, Rokugawa, Akio
Year of Publication 08.05.2003

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Semiconductor package and method of production thereof

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 08.05.2003

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Build-up board package for semiconductor devices

by Iijima, Takahiro, Rokugawa, Akio
Year of Publication 22.01.2002

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Build-up board package for semiconductor devices

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 22.01.2002

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Package for semiconductor devices

by ROKUGAWA AKIO, IIJIMA TAKAHIRO
Year of Publication 01.11.2001

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Package for semiconductor devices

by Iijima, Takahiro, Rokugawa, Akio
Year of Publication 01.11.2001

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Semiconductor device substrate, semiconductor device, and manufacturing method thereof

by Ooi, Kiyoshi, Horikawa, Yasuyoshi, Rokugawa, Akio
Year of Publication 22.07.2008

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Semiconductor device substrate, semiconductor device, and manufacturing method thereof

by ROKUGAWA AKIO, OOI KIYOSHI, HORIKAWA YASUYOSHI
Year of Publication 22.07.2008

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