Laser assisted SiC wafering using COLD SPLIT
Swoboda, Marko, Beyer, Christian, Rieske, Ralf, Drescher, Wolfram, Richter, Jan
Published in 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM) (15.05.2017)
Published in 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM) (15.05.2017)
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Conference Proceeding
Journal Article
Cold Split Kerf-Free Wafering Results for Doped 4H-SiC Boules
Swoboda, Marko, Rieske, Ralf, Gesell, Gino, Richter, Jan, Ullrich, Albrecht, Beyer, Christian
Published in Materials science forum (19.07.2019)
Published in Materials science forum (19.07.2019)
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Journal Article
Laser-assisted spalling of large-area semiconductor and solid state substrates
Kaule, Felix, Swoboda, Marko, Beyer, Christian, Rieske, Ralf, Ajaj, Anas, Drescher, Wolfram D., Schoenfelder, Stephan, Richter, Jan
Published in MRS communications (01.03.2018)
Published in MRS communications (01.03.2018)
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Journal Article
솔리드 스테이트에서 평탄한 개질을 생성하는 방법 및 장치
GUENTHER CHRISTOPH, RICHTER JAN, BEYER CHRISTIAN, SWOBODA MARKO, RIESKE RALF
Year of Publication 06.09.2018
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Year of Publication 06.09.2018
Patent