Wafer Level Integration of 3-D Heat Sinks in Power ICs
Para, Isabella, Marasso, S. L., Perrone, D., Gentile, M. G., Sanfilippo, C., Richieri, Giovanni, Merlin, Luigi, Pugliese, D., Cocuzza, M., Ferrero, S., Scaltrito, L., Pirri, C. F.
Published in IEEE transactions on electron devices (01.10.2017)
Published in IEEE transactions on electron devices (01.10.2017)
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Journal Article
LOCAL SEMICONDUCTOR WAFER THINNING
RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Year of Publication 08.05.2019
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Year of Publication 08.05.2019
Patent
LOCAL SEMICONDUCTOR WAFER THINNING
RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Year of Publication 22.08.2018
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Year of Publication 22.08.2018
Patent
Local semiconductor wafer thinning
Merlin, Luigi, Richieri, Giovanni, Para, Isabella, Carmelo, Sanfilippo
Year of Publication 07.08.2018
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Year of Publication 07.08.2018
Patent