Experimental validation of a simple fractional model for viscoelastic behavior of high filled polymer-based composites
Fan, Jianfeng, Wu, Weijian, Zeng, Xiangliang, Pang, Yunsong, Zhou, Yu, Sun, Rong, Zeng, Xiaoliang, Ren, Linlin
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
A sensitive competitive enzyme immunoassay for detection of erythrosine in foodstuffs
ZHIHUAN XU, LEI ZHENG, YONGMEI YIN, JING WANG, PENG WANG, LINLIN REN, EREMIN, Sergei A, XIAODAN HE, MENG MENG, RIMO XI
Published in Food control (2015)
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Published in Food control (2015)
Journal Article
Optimizing Thermal Properties of Thermal Interface Materials Using the Adhesion Mechanism of Gecko's Setae
Ding, Shengchang, He, Dongyi, Cai, Linfeng, Zeng, Xiangliang, Zeng, Xiaoliang, Ren, Linlin, Du, Guoping, Fan, Jianfeng
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
The coupling relationship between thermal conductivity and the toughness in thermal interface materials
Wen, Zhibin, Ji, Yinggang, Pang, Yunsong, Ai, Daifeng, Xu, Yonglun, Ren, Linlin, Zeng, Xiaoliang, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package
Zhong, Cheng, Li, Chenglong, Jiang, Ruoyu, Li, Yulong, Peng, Xu, Lu, Jibao, Ren, Linlin, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Indirect Competitive Immunoassay for Detection of Vitamin B2 in Foods and Pharmaceuticals
PENG WANG, YONGMEI YIN, EREMIN, Sergei A, RYBAKOV, Victor B, TAICHANG ZHANG, ZHIHUAN XU, LINLIN REN, XIAODAN HE, MENG MENG, RIMO XI
Published in Journal of agricultural and food chemistry (2013)
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Published in Journal of agricultural and food chemistry (2013)
Journal Article
High-Performance Thermal Grease with the Addition of Silver Particles
Zeng, Xiangliang, Wang, Zhenyu, Ye, Wenbo, Ren, Linlin, Zeng, Xiaoliang, Xia, Xinnian, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip
Ding, Sheng-Chang, Fan, Jian-Feng, He, Dong-Yi, Cai, Lin-Feng, Zeng, Xiang-Liang, Ren, Lin-Lin, Du, Guo-Ping, Zeng, Xiao-Liang, Sun, Rong
Published in Chip (Hong Kong) (01.06.2022)
Published in Chip (Hong Kong) (01.06.2022)
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Journal Article
Reliability and Thermal Degradation of First-Level Thermal Interface Materials
Su, Yunpeng, Li, Junhong, Ma, Qiangquiang, Ren, Linlin, Zeng, Xiaoliang, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Study on the Influence of Different Filler Fractions on the Properties of Thermal Interface Materials
Ye, Wenbo, Wang, Zhenyu, Zeng, Xiangliang, Ren, Linlin, Sun, Rong, Wen, Zhibin, Zeng, Xiaoliang
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Flexible Thermal Interface Materials Through Controlling the Ratio of Silicone Oil Functional Groups
Tu, Wendian, Ren, Linlin, Du, Guoping, Sun, Rong, Zeng, Xiaoliang, Li, Junwei
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Viscoelastic Characterization and Simulation of Thermal Interface Materials
Zhong, Cheng, Li, Chenglong, Wang, Yunxia, Lu, Jibao, Ren, Linlin, Sun, Rong, Wong, Ching-Ping
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding