Applications of C-AFM analysis techniques at advanced IC on ATPG/Scan failure
Chee Hong Chong, Hoe, Wilson Lee Cheng, Ren De Lin, Hong Bo Zhang
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Get full text
Conference Proceeding
C-AFM analysis of advanced IC on SRAM high resistance failure
Wai Tuck Leong, Hong Bo Zhang, Hoe, W. L. C., Ren De Lin
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
Get full text
Conference Proceeding
Effect of acupuncture at the acupoints for Yizhi Tiaoshen on the functional connectivity between the hippocampus and the brain in the patients with Alzheimer's disease
Wei, Yu-Ting, Su, Ming-Li, Zhu, Tian-Tian, Ren, De-Lin, Yan, Xing-Ke
Published in Zhōngguó zhēnjiǔ (12.12.2023)
Published in Zhōngguó zhēnjiǔ (12.12.2023)
Get more information
Journal Article
Effect of gamma ray irradiation on the conduction mechanisms of radio-frequency-sputtered Ta2O5 films
Wang, Ching-Wu, Chen, Shih-Fang, Lin, Ren-De
Published in IEEE transactions on nuclear science (01.08.2000)
Published in IEEE transactions on nuclear science (01.08.2000)
Get full text
Journal Article
Pregnancy outcomes of 194 couples with balanced translocations
Zhang, Yue-ping, Xu, Jian-zhong, Yin, Min, Chen, Mei-fang, Ren, De-lin
Published in Chung-hua fu chʿan kʿo tsa chih (01.09.2006)
Get more information
Published in Chung-hua fu chʿan kʿo tsa chih (01.09.2006)
Journal Article
Investigation of EOS damage issue induced by failure analysis on back-end test vehicle
Hong Bo Zhang, Kaeng Nan Liew, Ren De Lin
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Get full text
Conference Proceeding
A simple method for TEM sample preparation without carbon film background
Meng-Lung Lee, Ren-De Lin
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Get full text
Conference Proceeding
Applications of C-AFM analysis techniques at advanced IC on SRAM soft failure
Hong Bo Zhang, Hoe, Wilson Lee Cheng, Ren De Lin, Wai Tuck Leong
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Get full text
Conference Proceeding
Application of Back-side Laser Technique on Failure Analysis
Hoe, W.L.C., Ren De Lin, Chee Hong Chong, Coswin Lin
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
Get full text
Conference Proceeding
Effects of O/sub 2/ rapid thermal annealing on the microstructural properties and reliability of RF-sputtered Ta/sub 2/O/sub 5/ films
Ching-Wu Wang, Ren-De Lin, Shih-Fang Chen, Wen-Kuan Lin
Published in IEEE transactions on dielectrics and electrical insulation (01.06.2000)
Published in IEEE transactions on dielectrics and electrical insulation (01.06.2000)
Get full text
Journal Article
Effects of O sub(2) rapid thermal annealing on the microstructural properties and reliability of RF-sputtered Ta sub(2)O sub(5) films
Wang, Ching-Wu, Lin, Ren-De, Chen, Shih-Fang, Lin, Wen-Kuan
Published in IEEE transactions on dielectrics and electrical insulation (01.01.2000)
Get full text
Published in IEEE transactions on dielectrics and electrical insulation (01.01.2000)
Journal Article