Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Journal Article
Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules
Klemm, Alexander, Schmidt, Michael, Rittner, Martin, Guyenot, Michael, Reinold, Manfred, Holz, Rainer, Kessler, Ulrich
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding