Search Results - "REINHOLD WAHLICH" :: K.UTB vyhledávací portál

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Strukturierte Halbleiterscheibe und Verfahren zu deren Herstellung

by Murphy, Brian, Wahlich, Reinhold
Year of Publication 06.12.2018

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Multilayered semiconductor wafer and process for manufacturing the same

by WAHLICH REINHOLD, MURPHY BRIAN
Year of Publication 12.03.2013

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Multilayered Semiconductor Wafer and Process For Manufacturing The Same

by WAHLICH REINHOLD, MURPHY BRIAN
Year of Publication 29.12.2011

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Multilayered semiconductor wafer and process for manufacturing the same

by WAHLICH REINHOLD, MURPHY BRIAN
Year of Publication 18.10.2011

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Multilayered semiconductor wafer and process for manufacturing the same

by Murphy, Brian, Wahlich, Reinhold
Year of Publication 18.10.2011

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Strukturierte Halbleiterscheibe und Verfahren zu deren Herstellung

by Murphy, Brian, Wahlich, Reinhold
Year of Publication 01.12.2016

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MULTILAYERED SEMICONDUCTOR WAFER AND PROCESS FOR MANUFACTURING THE SAME

by WAHLICH REINHOLD, MURPHY BRIAN
Year of Publication 31.12.2009

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Method for reducing and homogenising the thickness of a semiconductor layer on the surface of an electrically insulating material

by FEIJOO, DIEGO, WAHLICH, REINHOLD, RIEMENSCHNEIDER, OLIVER
Year of Publication 09.04.2014

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MULTILAYERED SEMICONDUCTOR WAFER AND PROCESS FOR MANUFACTURING THE SAME

by WAHLICH, REINHOLD, MURPHY, BRIAN
Year of Publication 31.07.2008

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Verfahren zur Herstellung einer epitaktisch beschichteten Scheibe aus Halbleitermaterial

by Müller, Timo, Daub, Erich, Boy, Michael, Wahlich, Reinhold
Year of Publication 13.08.2020

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Multilayered semiconductor wafer and process for manufacturing the same

by WAHLICH, REINHOLD, MURPHY, BRIAN
Year of Publication 19.03.2008

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MULTILAYERED SEMICONDUCTOR WAFER AND PROCESS FOR MANUFACTURING THE SAME

by WAHLICH, REINHOLD, MURPHY, BRIAN
Year of Publication 06.03.2008

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TWI415184B

by WAHLICH, REINHOLD, RIEMENSCHNEIDER, OLIVER
Year of Publication 11.11.2013

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Method for reducing and homogenizing the thickness of a semiconductor layer which lies on the surface of an electrically insulating material

by RIEMENSCHNEIDER OLIVER, WAHLICH REINHOLD, FEIJOO DIEGO
Year of Publication 02.08.2011

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Method for reducing and homogenizing the thickness of a semiconductor layer which lies on the surface of an electrically insulating material

by Feijoo, Diego, Riemenschneider, Oliver, Wahlich, Reinhold
Year of Publication 02.08.2011

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Method and apparatus for the treatment of a semiconductor wafer

by WAHLICH REINHOLD, MURPHY BRIAN, FEIJOO DIEGO
Year of Publication 21.09.2010

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Method and apparatus for the treatment of a semiconductor wafer

by Murphy, Brian, Feijóo, Diego, Wahlich, Reinhold
Year of Publication 21.09.2010

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SOI wafer and method for producing it

by Graef, Dieter, Blietz, Markus, Wahlich, Reinhold, Miller, Alfred, Zemke, Dirk
Year of Publication 04.12.2012

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SOI wafer and method for producing it

by ZEMKE DIRK, BLIETZ MARKUS, MILLER ALFRED, WAHLICH REINHOLD, GRAEF DIETER
Year of Publication 04.12.2012

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Multilayered semiconductor wafer and process for manufacturing the same

by WAHLICH REINHOLD, MURPHY BRIAN
Year of Publication 22.08.2012

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