Scientific and Engineering Computing Using ATI Stream Technology
Bayoumi, Amr, Chu, Michael, Hanafy, Yasser, Harrell, Patricia, Refai-Ahmed, Gamal
Published in Computing in science & engineering (01.11.2009)
Published in Computing in science & engineering (01.11.2009)
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Journal Article
열 관리 장치를 포함하는 이종 통합 모듈
CHANG KEN, FRANS YOHAN, XIE CHUAN, REFAI AHMED GAMAL, RAMALINGAM SURESH, RAJ MAYANK
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES
GOWDA ARUN VIRUPAKSHA, REFAI AHMED GAMAL, GIOVANNIELLO CHRISTIAN, VOGEL JOHN ANTHONY, SHADDOCK DAVID MULFORD
Year of Publication 07.12.2015
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Year of Publication 07.12.2015
Patent
THERMAL CLAMP APPARATUS FOR ELECTRONICS SYSTEM
GIOVANNIELLO CHRISTIAN M, UTTURKAR YOGEN VISHWAS, REFAI AHMED GAMAL, DE BOCK HENDRIK PIETER JACOBUS
Year of Publication 02.12.2015
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Year of Publication 02.12.2015
Patent
Design guideline on board-level thermomechanical reliability of 2.5D package
Shao, Shuai, Niu, Yuling, Wang, Jing, Liu, Ruiyang, Park, Seungbae, Lee, Hohyung, Yip, Laurene, Refai-Ahmed, Gamal
Published in Microelectronics and reliability (01.08.2020)
Published in Microelectronics and reliability (01.08.2020)
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Journal Article
Novel Programmable Package-level 3D Thermal Evaluation System
Parameswaran, Suresh, Refai-Ahmed, Gamal, Ramalingam, Suresh, Chang, Jonathan, Balakrishnan, Saravanan
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
BLACK BRYAN, SU MICHAEL Z, PREJEAN SETH, REFAI AHMED GAMAL, SIEGEL JOE
Year of Publication 03.09.2013
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Year of Publication 03.09.2013
Patent
Finite Element Modeling Strategies for Studying Mechanical Design Tradeoffs in Heterogeneously Integrated Packages
Halbrooks, David N., Subbarayan, Ganesh, Wang, Huayan, Refai-Ahmed, Gamal, Ramalingam, Suresh
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Product-level reliability estimator with budget-based reliability management in 16nm technology
Jae-Gyung Ahn, Ming Feng Lu, Navale, Nitin, Graves, Dawn, Refai-Ahmed, Gamal, Ping-Chin Yeh, Chang, Jonathan
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding