AN APPARATUS AND METHOD OF FORMING A POLISHING ARTICLE THAT HAS A DESIRED ZETA POTENTIAL
CHOCKALINGAM ASHWIN, FU BOYI, BAJAJ RAJEEV, ORILALL MAHENDRA C, REDFIELD DANIEL, YAMAMURA MAYU
Year of Publication 15.12.2023
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Year of Publication 15.12.2023
Patent
인-시튜로 표면 텍스처를 재생성하기 위해 적층 제조 프로세스를 사용하여 형성된 구조들
JAWALI PUNEET NARENDRA, BAJAJ RAJEEV, KAKIREDDY VEERA RAGHAVA REDDY, REDFIELD DANIEL
Year of Publication 11.10.2023
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Year of Publication 11.10.2023
Patent
Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance
Khanna, Aniruddh J., Yamamura, Mayu, Kakireddy, Veera Raghava, Chockalingam, Ashwin, Jawali, Puneet, Baradanahalli Kenchappa, Nandan, Hariharan, Venkat, Redfield, Daniel, Bajaj, Rajeev
Published in ECS journal of solid state science and technology (03.08.2020)
Published in ECS journal of solid state science and technology (03.08.2020)
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Journal Article
Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes
Khanna, Aniruddh J., Kakireddy, Veera Raghava, Fung, Jason, Yamamura, Mayu, Jawali, Puneet, Chockalingam, Ashwin, Baradanahalli Kenchappa, Nandan, Redfield, Daniel, Bajaj, Rajeev
Published in ECS journal of solid state science and technology (12.10.2020)
Published in ECS journal of solid state science and technology (12.10.2020)
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Journal Article
POLISHING PADS FORMED USING AN ADDITIVE MANUFACTURING PROCESS AND METHODS RELATED THERETO
CHOCKALINGAM ASHWIN, GANAPATHIAPPAN SIVAPACKIA, BAJAJ RAJEEV, REDFIELD DANIEL, FUNG JASON G
Year of Publication 30.03.2023
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Year of Publication 30.03.2023
Patent
Methodology for pad conditioning sweep optimization for advanced nodes
Khanna, Aniruddh J., Jawali, Puneet, Redfield, Daniel, Kakireddy, Raghava, Chockalingam, Ashwin, Benvegnu, Dominic, Yang, Mo, Rozo, Sebastian, Fung, Jason, Cornejo, Mario, Abramson, Igor, Yamamura, Mayu, Yuan, Zhibo, Bajaj, Rajeev
Published in Microelectronic engineering (15.08.2019)
Published in Microelectronic engineering (15.08.2019)
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Journal Article
High-Performance Pad Conditioning (HPPC) Arm for Augmenting CMP Performance
Khanna, Aniruddh J., Kakireddy, Veera Raghava, Fung, Jason, Jawali, Puneet, Yamamura, Mayu, Baradanahalli Kenchappa, Nandan, Hariharan, Venkat, Redfield, Daniel, Bajaj, Rajeev
Published in ECS journal of solid state science and technology (03.08.2020)
Published in ECS journal of solid state science and technology (03.08.2020)
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Journal Article
CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES
PATIBANDLA NAG B, BAJAJ RAJEEV, ORILALL MAHENDRA C, REDFIELD DANIEL, PERRY RUSSELL EDWARD, MENK GREGORY E, FUNG JASON G, KRISHNAN KASIRAMAN, REDEKER FRED C, DAVENPORT ROBERT E
Year of Publication 02.02.2024
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Year of Publication 02.02.2024
Patent
POROUS CHEMICAL MECHANICAL POLISHING PADS
GANAPATHIAPPAN SIVAPACKIA, FU BOYI, CHOCKALINGAM ASHWIN, PATIBANDLA NAG B, BAJAJ RAJEEV, ORILALL MAHENDRA C, REDFIELD DANIEL, YAMAMURA MAYU, REDEKER FRED C
Year of Publication 02.02.2024
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Year of Publication 02.02.2024
Patent
POLISHING PAD WITH WINDOW AND MANUFACTURING METHODS THEREOF
CORNEJO MARIO DAGIO, FU BOYI, GANAPATHIAPPAN SIVAPACKIA, CHOCKALINGAM ASHWIN, PATIBANDLA NAG B, BAJAJ RAJEEV, BENVEGNU DOMINIC J, REDFIELD DANIEL, VORA ANKIT, YAMAMURA MAYU
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
개선된 기공 구조를 갖는 연마 패드들
SRIDHAR UMA, LUO YINGDONG, GANAPATHIAPPAN SIVAPACKIA, CHOCKALINGAM ASHWIN, PATIBANDLA NAG B, ROZO SEBASTIAN DAVID, BAJAJ RAJEEV, MADHUSOODHANAN SUDHAKAR, REDFIELD DANIEL, NG HOU T, YAMAMURA MAYU
Year of Publication 22.01.2024
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Year of Publication 22.01.2024
Patent
CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING
YAMAMURA MAYU FELICIA, BAJAJ RAJEEV, FUNG JASON GARCHEUNG, REDFIELD DANIEL, NG HOU T
Year of Publication 13.12.2021
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Year of Publication 13.12.2021
Patent
PRINTED CHEMICAL MECHANICAL POLISHING PAD
MICHAELSON TIMOTHY, PATIBANDLA NAG B, BAJAJ RAJEEV, ORILALL MAHENDRA C, REDFIELD DANIEL, MENK GREGORY E, KRISHNAN KASIRAMAN, REDEKER FRED C
Year of Publication 05.08.2022
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Year of Publication 05.08.2022
Patent
Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies
Khanna, Aniruddh J., Kakireddy, Raghava, Jawali, Puneet, Chockalingam, Ashwin, Redfield, Daniel, Bajaj, Rajeev, Fung, Jason, Cornejo, Mario, Yamamura, Mayu, Yuan, Zhibo, Orilall, Chris, Fu, Boyi, Ganapathi, Gana, Redeker, Fred C, Patibandla, Nag B
Published in ECS journal of solid state science and technology (2019)
Published in ECS journal of solid state science and technology (2019)
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Journal Article
적층 제조 프로세스를 사용하여 형성되는 폴리싱 패드들 및 이와 관련된 방법들
CHOCKALINGAM ASHWIN, GANAPATHIAPPAN SIVAPACKIA, BAJAJ RAJEEV, REDFIELD DANIEL, FUNG JASON G
Year of Publication 19.02.2021
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Year of Publication 19.02.2021
Patent
POLISHING ARTICLES AND INTEGRATED SYSTEM AND METHODS FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING ARTICLES
PATIBANDLA NAG B, BAJAJ RAJEEV, ORILALL MAHENDRA C, REDFIELD DANIEL, PERRY RUSSELL EDWARD, MENK GREGORY E, FUNG JASON G, KRISHNAN KASIRAMAN, REDEKER FRED C
Year of Publication 21.10.2022
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Year of Publication 21.10.2022
Patent