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METHODS AND APPARATUS FOR FORMING FLOWABLE DIELECTRIC FILMS HAVING LOW POROSITY
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Year of Publication 30.04.2015
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Selective deposition of WCN barrier/adhesion layer for interconnect
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Year of Publication 16.12.2018
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BOTTOM UP FILL IN HIGH ASPECT RATIO TRENCHES
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Year of Publication 14.06.2012
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Bottom up fill in high aspect ratio trenches
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Year of Publication 01.05.2017
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Methods and apparatus for forming flowable dielectric films having low porosity
VAN SCHRAVENDIJK, BART J, PADHI, DEENESH, DRAEGER, NERISSA, RATHOD, MEGHA, ASHTIANI, KAIHAN
Year of Publication 01.08.2015
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Year of Publication 01.08.2015
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Bottom up fill in high aspect ratio trenches
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Year of Publication 16.11.2012
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Bottom up fill in high aspect ratio trenches
RATHOD MEGHA, DRAEGER NERISSA, TE NIJENHUIS HARALD, DANEK MICHAEL, NITTALA LAKSHMINARAYANA, VAN SCHRAVENDIJK BART, SHANNON KARENA
Year of Publication 11.07.2012
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Year of Publication 11.07.2012
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