Method for reducing underfill filler settling in integrated circuit packages
Phen Michelle S, Xiu Yonghao, Arora Hitesh, Dias Rajendra C, Bai Yiqun, Ramalingam Suriyakala, Ananthakrishnan Nisha, Dubey Manish, Li Hsin-Yu
Year of Publication 30.08.2016
Get full text
Year of Publication 30.08.2016
Patent
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMPS AND STRUCTURES FORMED THEREBY
NAGARAJAN SIVAKUMAR, ANANTHAKRISHNAN NISHA, BAI YIQUN, JAYARAMAN SAIKUMAR, CANHAM BEVERLY J, KRISHNAN ARJUN, WEI YUYING, XIU YONGHAO, RAMALINGAM SURIYAKALA
Year of Publication 26.06.2014
Get full text
Year of Publication 26.06.2014
Patent
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PACKAGES AND ITS EXTENDIBILITY AS A BARRIER MATERIAL FOR THERMAL AND SEALANT MATERIALS
LOWE, JR. RANDALL D, ANANTHAKRISHNAN NISHA, ARORA HITESH, RAMALINGAM SURIYAKALA SURIYA, KRISHNAN ARJUN, MATAYABAS, JR. JAMES C
Year of Publication 18.06.2015
Get full text
Year of Publication 18.06.2015
Patent
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
LOWE, JR. RANDALL D, ANANTHAKRISHNAN NISHA, ARORA HITESH, RAMALINGAM SURIYAKALA SURIYA, KRISHNAN ARJUN, MATAYABAS, JR. JAMES C
Year of Publication 02.12.2014
Get full text
Year of Publication 02.12.2014
Patent
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PACKAGES AND ITS EXTENDIBILITY AS A BARRIER MATERIAL FOR THERMAL AND SEALANT MATERIALS
LOWE, JR. RANDALL D, ANANTHAKRISHNAN NISHA, ARORA HITESH, RAMALINGAM SURIYAKALA SURIYA, KRISHNAN ARJUN, MATAYABAS, JR. JAMES C
Year of Publication 18.09.2014
Get full text
Year of Publication 18.09.2014
Patent
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
ANANTHAKRISHNAN NISHA, ARORA HITESH, BAI YIQUN, PHEN MICHELLE S, DIAS RAJENDRA C, DUBEY MANISH, LI HSIN-YU, XIU YONGHAO, RAMALINGAM SURIYAKALA
Year of Publication 26.06.2014
Get full text
Year of Publication 26.06.2014
Patent
On package floating metal/stiffener grounding to mitigate rfi and si risks
CHENEY, ROBERT F, WENG, LI-SHENG, STOVER, PATRICK N, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, JIANG, HONGJIN, STARKSTON, ROBERT
Year of Publication 11.05.2019
Get full text
Year of Publication 11.05.2019
Patent
Potentialfreie Metall/Versteifungs-Erdung am Gehäuse, um RFI- und SI-Risiken zu mildern
Dhall, Ashish, Starkston, Robert, Raorane, Digvijay A, Jones, Keith D, Dhane, Kedar, Weng, Li-Sheng, Jiang, Hongjin, Ramalingam, Suriyakala, Cheney, Robert F, Karhade, Omkar G, Stover, Patrick N
Year of Publication 15.09.2016
Get full text
Year of Publication 15.09.2016
Patent
On package floating metal/stiffener grounding to mitigate RFI and SI risks
JIANG, HONG-JIN, CHENEY, ROBERT F, WENG, LI-SHENG, STOVER, PATRICK N, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, STARKSTON, ROBERT
Year of Publication 16.01.2017
Get full text
Year of Publication 16.01.2017
Patent
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
CHENEY, ROBERT F, STOVER, PATRICK N, WENG, LI-SHENG, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, JIANG, HONGJIN, STARKSTON, ROBERT
Year of Publication 21.09.2016
Get full text
Year of Publication 21.09.2016
Patent