Spectroscopic Analysis of Amorphous Structure in Fluorinated Polymers
Yang, Yuning, Wu, Guolin, Ramalingam, Suriyakala, Hsu, Shaw Ling, Kleiner, Lothar, Tang, Fuh Wei
Published in Macromolecules (25.12.2007)
Published in Macromolecules (25.12.2007)
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Journal Article
An analysis of the role of wax in hot melt adhesives
Kalish, Jeffrey P., Ramalingam, Suriyakala, Bao, Huimin, Hall, Douglas, Wamuo, Onyenkachi, Hsu, Shaw Ling, Paul, Charles W., Eodice, Andrea, Low, Yew-Guan
Published in International journal of adhesion and adhesives (01.07.2015)
Published in International journal of adhesion and adhesives (01.07.2015)
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Journal Article
ON PACKAGE FLOATING METAL/STIFFENER GROUNDING TO MITIGATE RFI AND SI RISKS
CHENEY ROBERT F, RAORANE DIGVIJAY A, JIANG HONGJIN, STARKSTON ROBERT, JONES KEITH D, DHALL ASHISH, STOVER PATRICK N, DHANE KEDAR, WENG LI SHENG, KARHADE OMKAR G, RAMALINGAM SURIYAKALA
Year of Publication 21.09.2016
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Year of Publication 21.09.2016
Patent
Influence of Copolymer Configuration on the Phase Behavior of Ternary Blends
Jeong, Young Gyu, Ramalingam, Suriyakala, Archer, Jared, Hsu, Shaw Ling, Paul, Charles W
Published in The journal of physical chemistry. B (16.02.2006)
Published in The journal of physical chemistry. B (16.02.2006)
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Journal Article
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
PATEL, Jigneshkumar, DUAN, Gang, BRUN, Xavier, MEHTA, Vipul, YERRAMILLI, Aditya Sumanth, RAMALINGAM, Suriyakala, LIN, Ziyin, XU, Dingying, CROISSANT, Jonas
Year of Publication 09.05.2024
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Year of Publication 09.05.2024
Patent
Apparatus and method for conformal coating of integrated circuit packages
Aspandiar, Raiyomand F, Ramalingam, Suriyakala, Dobriyal, Priyanka, Lee, Chester C
Year of Publication 16.07.2019
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Year of Publication 16.07.2019
Patent
MICROELECTRONIC PACKAGE ADHESIVES
RAMALINGAM, Suriyakala Suriya, PRAKASH, Anne M, GAINES, Taylor, SALTAS, Mark
Year of Publication 04.04.2019
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Year of Publication 04.04.2019
Patent
CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES
LEE, Chester C, DOBRIYAL, Priyanka, RAMALINGAM, Suriyakala, ASPANDIAR, Raiyomand F
Year of Publication 15.03.2018
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Year of Publication 15.03.2018
Patent
CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES
Dobriyal Priyanka, Lee Chester C, Aspandiar Raiyomand F, Ramalingam Suriyakala
Year of Publication 08.03.2018
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Year of Publication 08.03.2018
Patent
Conformal coating challenges: Detection, rework and failure analysis
Dobriyal, Priyanka, Ramalingam, Suriyakala, Shu Lee Lim, Kurella, Anil
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
Published in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) (01.01.2016)
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Conference Proceeding
Coupling a magnet with a MEMS device
Starkston, Robert, Labanok, Nick, Choudhury, Arnab, Abebaw, Amanuel M, Prakash, Anna M, Ramalingam, Suriyakala, Yazzie, Kyle, Wang, Liwei, Iyer, Sandeep S
Year of Publication 01.06.2021
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Year of Publication 01.06.2021
Patent
Compartment for magnet placement
Abebaw, Amanuel, Saltas, Mark, Ramalingam, Suriyakala, Patel, Mayank, Gurumurthy, Charavana K, Iyer, Sandeep S, Malamud, Vladimir
Year of Publication 11.06.2019
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Year of Publication 11.06.2019
Patent
Mold compound with reinforced fibers
Krishnan Arjun, Bai Yiqun, Ramalingam Suriyakala, Ananthakrishnan Nisha
Year of Publication 11.07.2017
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Year of Publication 11.07.2017
Patent