A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction
Zhang, Li, Rafei, Siti Mohamed, Xie, Ling, Chew, Michelle Bi-Rong, Ji, Hong Miao, Chen, Yu, Rajoo, Ranjan, Ong, Kian-Leong, Tan, Rosemary, Lau, Suk-Hiang, Chow, Vincent T.K., Heng, Chew-Kiat, Teo, Keng-Hwa, Kang, Tae Goo
Published in Sensors and actuators. B, Chemical (15.12.2011)
Published in Sensors and actuators. B, Chemical (15.12.2011)
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Journal Article
Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures
Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Mo, Zhi Qiang
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Material characterization for nano wafer level packaging application
Sau Koh, Ranjan Rajoo, Rao Tummala, Ashok Saxena, Kuo Tsing Tsai
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device
Xiaowu Zhang, Rajoo, R., Selvanayagam, C. S., Kumar, A., Rao, V. S., Khan, N., Kripesh, V., Lau, J. H., Dim-Lee Kwong, Sundaram, V., Tummala, R. R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
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Journal Article
Impact of High Temperature Storage for Prolonged Duration on Cu Leadframe Material Properties for Automotive Applications
Zhu, Xintong, Rajoo, Ranjan, Yip, Kim Hong, Ang, Poh Chuan, Nistala, Ramesh Rao, Mo, Zhi Qiang
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Dicing Blade Characterization Using Nano-indentation
Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Chan, Kai Chong, Mo, Zhi Qiang
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
Rao, V. S., Sekhar, V. N., Ho Soon Wee, Rajoo, R., Sharma, G., Lim Ying Ying, Damaruganath, P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
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Journal Article
Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages
Sharma, G, Rao, V S, Kumar, A, Lim Ying Ying, Khong Chee Houe, Lim, S, Sekhar, V N, Rajoo, R, Kripesh, V, Lau, J H
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Journal Article
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Bonding structures of semiconductor devices
Chan, Kai Chong, Tan, Juan Boon, Li, Xiaodong, Rajoo, Ranjan, Chockalingam, Ramasamy
Year of Publication 13.09.2022
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Year of Publication 13.09.2022
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