Search Results - "RAE, David Fraser" :: K.UTB vyhledávací portál

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전자기 간섭 차폐부로서 구성된 수동 디바이스를 포함하는 패키지

by RAE DAVID FRASER, HAN JEAHYEONG, KUMAR RAJNEESH
Year of Publication 17.03.2023

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열 확산기로서 구성된 기판을 포함하는 패키지

by RAE DAVID FRASER, HOLMES JOHN, KANG KUIWON, HSU MARCUS, SODHI AVANTIKA
Year of Publication 13.10.2022

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인터커넥트 구조체를 갖는 3D 컴포넌트를 내장하기 위한 시스템, 장치, 및 방법

by RAE DAVID FRASER, ALVARADO REYNANTE TAMUNAN, KESER LIZABETH ANN
Year of Publication 30.01.2018

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PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT

by RAE DAVID FRASER, BCHIR OMAR JAMES, SHAH MILIND PRAVIN, KIM CHIN KWAN, HSU MARCUS BERNARD
Year of Publication 25.11.2015

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Package comprising passive device configured as electromagnetic interference shield

by Han, Jeahyeong, Kumar, Rajneesh, Rae, David Fraser
Year of Publication 06.06.2023

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PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD

by RAE, David Fraser, KUMAR, Rajneesh, HAN, Jeahyeong
Year of Publication 17.05.2023

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PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD

by RAE, David Fraser, KUMAR, Rajneesh, HAN, Jeahyeong
Year of Publication 13.01.2022

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PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD

by RAE, David Fraser, KUMAR, Rajneesh, HAN, Jeahyeong
Year of Publication 13.01.2022

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Package comprising multi-level vertically stacked redistribution portions

by We, Hong Bok, Patil, Aniket, Rae, David Fraser
Year of Publication 15.11.2022

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ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE

by PATIL, Aniket, RAE, David Fraser, WE, Hong Bok
Year of Publication 10.08.2022

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Ultra-low profile stacked RDL semiconductor package

by We, Hong Bok, Patil, Aniket, Rae, David Fraser
Year of Publication 19.07.2022

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PACKAGE COMPRISING MULTI-LEVEL VERTICALLY STACKED REDISTRIBUTION PORTIONS

by PATIL, Aniket, RAE, David Fraser, WE, Hong Bok
Year of Publication 11.11.2021

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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS

by We, Hong Bok, Hsu, Marcus, Patil, Aniket, Rae, David Fraser
Year of Publication 09.09.2021

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ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE

by PATIL, Aniket, RAE, David Fraser, WE, Hong Bok
Year of Publication 08.04.2021

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ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE

by PATIL, Aniket, RAE, David Fraser, WE, Hong Bok
Year of Publication 08.04.2021

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PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER

by SODHI, Avantika, HSU, Marcus, KANG, Kuiwon, RAE, David Fraser, HOLMES, John
Year of Publication 21.12.2022

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Package comprising a substrate configured as a heat spreader

by Kang, Kuiwon, Sodhi, Avantika, Holmes, John, Hsu, Marcus, Rae, David Fraser
Year of Publication 02.08.2022

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Package comprising passive device configured as electromagnetic interference shield

by RAE DAVID FRASER, HAN JUN, KUMAR RAJNEESH
Year of Publication 17.03.2023

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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS

by PATIL, Aniket, HSU, Marcus, RAE, David Fraser, WE, Hong Bok
Year of Publication 21.10.2021

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PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES

by RAE, David, Fraser, KESER, Lizabeth, Ann
Year of Publication 28.02.2018

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