Island growth in electrodeposition
Guo, Lian, Oskam, Gerko, Radisic, Aleksandar, Hoffmann, Peter M, Searson, Peter C
Published in Journal of physics. D, Applied physics (09.11.2011)
Published in Journal of physics. D, Applied physics (09.11.2011)
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Journal Article
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro, Philipsen, Harold, Radisic, Aleksandar, Armini, Silvia, Civale, Yann, Leunissen, Peter, Kondo, Muneharu, Webb, Eric, Shingubara, Shoso
Published in Electrochimica acta (30.06.2013)
Published in Electrochimica acta (30.06.2013)
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Journal Article
Wafer-scale Cu plating uniformity on thin Cu seed layers
Yang, Liu, Atanasova, Tanya, Radisic, Aleksandar, Deconinck, Johan, West, Alan C., Vereecken, Philippe
Published in Electrochimica acta (01.08.2013)
Published in Electrochimica acta (01.08.2013)
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Journal Article
Electrodeposition of Copper on Oxidized Ruthenium
Guo, Lian, Radisic, Aleksandar, Searson, Peter C
Published in Journal of the Electrochemical Society (01.01.2006)
Published in Journal of the Electrochemical Society (01.01.2006)
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Journal Article
Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options
Armini, Silvia, Tokei, Zsolt, Volders, Henny, El-Mekki, Zaid, Radisic, Aleksandar, Beyer, Gerald, Ruythooren, Wouter, Vereecken, Philippe M.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Journal Article
Conference Proceeding
Direct copper electrodeposition on TaN barrier layers
RADISIC, Aleksandar, YANG CAO, TAEPHAISITPHONGSE, Premratn, WEST, Alan C, SEARSON, Peter C
Published in Journal of the Electrochemical Society (01.05.2003)
Published in Journal of the Electrochemical Society (01.05.2003)
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Journal Article
Copper Rich Cu 1-x Ni x Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
Haesevoets, Karel P. S., Radisic, Aleksandar, Vereecken, Philippe M.
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating
Yang, Liu, Radisic, Aleksandar, Deconinck, Johan, Vereecken, Philippe M.
Published in Journal of the Electrochemical Society (01.01.2014)
Published in Journal of the Electrochemical Society (01.01.2014)
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Journal Article
Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
Haesevoets, Karel P. S., Radisic, Aleksandar, Vereecken, Philippe M.
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2 for Thin-Film Energy Storage Devices
Deheryan, Stella, Zargouni, Yafa, Sinha, Rochan, Put, Brecht, Radisic, Aleksandar, Heyns, Marc, Vereecken, Philippe M.
Published in Journal of the Electrochemical Society (01.01.2017)
Published in Journal of the Electrochemical Society (01.01.2017)
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Journal Article
Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO 2 for Thin-Film Energy Storage Devices
Deheryan, Stella, Zargouni, Yafa, Sinha, Rochan, Put, Brecht, Radisic, Aleksandar, Heyns, Marc, Vereecken, Philippe M.
Published in Journal of the Electrochemical Society (2017)
Published in Journal of the Electrochemical Society (2017)
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Journal Article
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu, Radisic, Aleksandar, Nagar, Magi, Deconinck, Johan, Vereecken, Philippe M., West, Alan C.
Published in Electrochimica acta (01.09.2012)
Published in Electrochimica acta (01.09.2012)
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Journal Article