Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting
Bispo, I., Couturier, B., Haumesser, P.H., Mangiagalli, P., Monchoix, H., Passemard, G., Peyne, C., Roy, S., Thieriet, N., Rabinzohn, P., Bureau, C.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
TRAVALY, Y, EYCKENS, B, SCHAEKERS, M, BENDER, H, ROSSEEL, E, VANHAELEMEERSCH, S, MAEX, K, GAILLARD, F, VAN AUTRYVE, L, RABINZOHN, P, CARBONEL, L, ROTHSCHILD, A, LE, Q. T, BRONGERSMA, S. H, CIOFI, I, STRUYF, H, FURUKAWA, Y, STUCCHI, M
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
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Integration of a stack of two fluorine doped silicon oxide thin films with interconnect metallization for a sub-0.35 μm inter-metal dielectric application
Baud, L., Passemard, G., Gobil, Y., M'Saad, H., Corte, A., Pires, F., Fugier, P., Noel, P., Rabinzohn, P., Beinglass, I.
Published in Microelectronic engineering (01.11.1997)
Published in Microelectronic engineering (01.11.1997)
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Native oxide free polycrystalline/single crystal Si interface obtained by in situ cleaning: effects on the electrical performances of polysilicon emitter transistors
Puglisi, R.A., Lombardo, S.A., Spinella, C., Campisano, S.U., Monchoix, H., Rabinzohn, P.
Published in Solid-state electronics (01.11.1999)
Published in Solid-state electronics (01.11.1999)
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Cleaning of Si and GaAs crystal surfaces by ion bombardment in the 50-1500 eV range: influence of bombarding energy and sample temperature on damage and incorporation
RABINZOHN, P, GAUTHERIN, G, AGIUS, B, COHEN, C
Published in Journal of the Electrochemical Society (01.04.1984)
Published in Journal of the Electrochemical Society (01.04.1984)
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High quality plasma planarization: methodology and application to maskless selective interconnection
Rabinzohn, P., Villalon, C., Pasqualini, F., Gourrier, S.
Published in Microelectronic engineering (1990)
Published in Microelectronic engineering (1990)
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The new two-dimensional electron gas base HBT (2DEG-HBT): two-dimensional numerical simulation
Rabinzohn, P.D., Usagawa, T., Mizuta, H., Yamaguchi, K.
Published in IEEE transactions on electron devices (01.02.1991)
Published in IEEE transactions on electron devices (01.02.1991)
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Journal Article
Impact of material/process interactions on the properties of a porous CVD-O 3 low-k dielectric film
Travaly, Y, Eyckens, B, Carbonel, L, Rothschild, A, Le, Q.T, Brongersma, S.H, Ciofi, I, Struyf, H, Furukawa, Y, Stucchi, M, Schaekers, M, Bender, H, Rosseel, E, Vanhaelemeersch, S, Maex, K, Gaillard, F, Van Autryve, L, Rabinzohn, P
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
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Materials and processing for 0.25 μm multilevel interconnect
Bakli, Mouloud, Baud, Laurence, M'Saad, Hichem, Pique, Didier, Rabinzohn, Patrick
Published in Microelectronic engineering (1997)
Published in Microelectronic engineering (1997)
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On the determination of the specific contact resistance of alloyed contacts to n-GaAs
ROBINZOHN, P, KOBAYASHI, M, GOTO, S, KAWATA, M, USAGAWA, T
Published in Japanese Journal of Applied Physics (01.10.1990)
Published in Japanese Journal of Applied Physics (01.10.1990)
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Integration of a stack of two fluorine doped silicon oxide thin films with interconnect metallization for a sub-0.35 /spl mu/m inter-metal dielectric applications
Baud, L., Passermard, G., Gobil, Y., M'Saad, H., Corte, A., Pires, F., Fugier, P., Noel, P., Rabinzohn, P., Beinglass, I.
Published in European Workshop Materials for Advanced Metallization (1998)
Published in European Workshop Materials for Advanced Metallization (1998)
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Conference Proceeding
Integration of a stack of two fluorine doped silicon oxide thin films with interconnect metallization for a sub-0.35 /spl mu/m inter-metal dielectric applications
Baud, L., Passemard, G., Gobil, Y., M'Saad, H., Corte, A., Pires, F., Fugler, P., Noel, P., Rabinzohn, P., Beinglass, I.
Published in European Workshop Materials for Advanced Metallization (1997)
Published in European Workshop Materials for Advanced Metallization (1997)
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Conference Proceeding