A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
Kappert, Holger, Braun, Sebastian, Kordas, Norbert, Kosfeld, Andre, Utz, Alexander, Weber, Constanze, Rämer, Olaf, Spanier, Malte, Ihle, Martin, Ziesche, Steffen, Kokozinski, Rainer
Published in Journal of microelectronics and electronic packaging (01.01.2022)
Published in Journal of microelectronics and electronic packaging (01.01.2022)
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Journal Article
Cu- Sintering on Organic and Inorganic Substrates for Power Modules
Albrecht, Hans-Jurgen, Busse, Dirk, Dahlbudding, Alexander, Hutzler, Aaron, Ramer, Olaf
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Cu-Sintering on Organic Packages for Power Modules
Hans-Jurgen, Albrecht, Dirk, Busse, Alexander, Dahlbudding, Aaron, Hutzler, Olaf, Ramer, Ichiro, Ota, Hideo, Nakako, Florian, Pape, Dewi, Nilasari
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding