Averaged Behavior Model of Current-Mode Buck Converters for Transient Power Noise Analysis
Huang, Anfeng, Sun, Jingdong, Kim, Hongseok, Xu, Zhenxue, Jin, Shuai, Wu, Songping, Yang, Zhiping, Qiu, Kelvin, Fan, Jun, Hwang, Chulsoon
Published in IEEE transactions on electromagnetic compatibility (01.06.2023)
Published in IEEE transactions on electromagnetic compatibility (01.06.2023)
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Journal Article
Analytical Equivalent Circuit Modeling for BGA in High-Speed Package
Shuai Jin, Dazhao Liu, Bichen Chen, Brooks, Rick, Qiu, Kelvin, Lim, Jane, Jun Fan
Published in IEEE transactions on electromagnetic compatibility (01.02.2018)
Published in IEEE transactions on electromagnetic compatibility (01.02.2018)
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Journal Article
A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair
Liehui Ren, Peng Shao, Qiu, Kelvin, Jane Lim, Brooks, Rick, Xinxin Tian, Yaojiang Zhang, Jun Fan
Published in IEEE transactions on electromagnetic compatibility (01.08.2015)
Published in IEEE transactions on electromagnetic compatibility (01.08.2015)
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Journal Article
Analytical equivalent circuit modeling for multiple core vias in a high-speed package
Shuai Jin, Ji Zhang, Jane Lim, Qiu, Kelvin, Brooks, Rick, Fan, Jun
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.07.2016)
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.07.2016)
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Conference Proceeding
PCB via to trace return loss optimization for >25Gbps serial links
Zhang, Ji, Lim, Jane, Yao, Wei, Qiu, Kelvin, Brooks, Rick
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Numerical investigation of glass-weave effects on high-speed interconnects in printed circuit board
Tian, Xinxin, Zhang, Yao-Jiang, Lim, Jane, Qiu, Kelvin, Brooks, Rick, Zhang, Ji, Fan, Jun
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Characterization of PCB dielectric properties using two striplines on the same board
Lei Hua, Bichen Chen, Shuai Jin, Koledintseva, Marina, Lim, Jane, Qiu, Kelvin, Brooks, Rick, Ji Zhang, Shringarpure, Ketan, Jun Fan
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
ASIC package design optimization for 10 Gbps and above backplane serdes links
Lim, J., Kai Soon Chow, Ji Zhang, Jianmin Zhang, Qiu, Kelvin, Brooks, Rick
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
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Conference Proceeding
ASIC package to board BGA discontinuity characterization in >10Gbps SerDes links
Lim, Jane, Ji Zhang, Wei Yao, Tseng, Kenneth, Qiu, Kelvin, Brooks, Rick, Jun Fan
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
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Conference Proceeding
Augmented Genetic Algorithm v3 for Multi-Objective PDN Decap Optimization
Manoharan, Haran, Juang, Jack, Wang, Hanfeng, Pan, Jingnan, Gao, Xu, Qiu, Kelvin, Hwang, Chulsoon
Published in 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) (20.05.2024)
Published in 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) (20.05.2024)
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Conference Proceeding
Augmented Genetic Algorithm v2 with Reinforcement Learning for PDN Decap Optimization
Manoharan, Haran, Juang, Jack, Wang, Hanfeng, Pan, Jingnan, Qiu, Kelvin, Gao, Xu, Hwang, Chulsoon
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
An Analysis on the Effectiveness of 2 and 3 Terminal Capacitors in PDN Design
Juang, Jack, Huang, Jiahuan, Huang, Anfeng, Qiu, Kelvin, Wang, Hanfeng, Wang, Yansheng, Yang, Zhiping, Hwang, Chulsoon
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
Ferrite bead model extraction and its application in high-performance ASIC analog power filtering
Jianmin Zhang, Qiu, K., Liming Yin, Brooks, R., Chen, B.
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
Using FSV in high-speed channel characterization and correlation
Ji Zhang, Jianmin Zhang, Lim, J., Qiu, K., Brooks, R., Chen, B.
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
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Conference Proceeding
Design and modeling for chip-to-chip communication at 20 Gbps
Jianmin Zhang, Chen, Q B, Qiu, K, Scogna, A C, Schauer, M, Romo, G, Drewniak, J L, Orlandi, A
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
Signal transition structure optimization for 16 Gbps SFP cage and PCB interface
Jianmin Zhang, Hanfeng Wang, Lim, J., Qiu, K., Brooks, R., Chen, B.
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
Enabling terabit per second switch linecard design through chip/package/PCB co-design
Chen, Q B, Jianmin Zhang, Qiu, K, Padilla, D, Zhiping Yang, Scogna, A C, Jun Fan
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
Design of package BGA pin-out for >25Gb/s high speed SerDes considering PCB via crosstalk
Wei Yao, Lim, Jane, Ji Zhang, Tseng, Kenneth, Qiu, Kelvin, Brooks, Rick
Published in 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (01.03.2015)
Published in 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (01.03.2015)
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Conference Proceeding
Electrical performance of via transitions in the presence of overlapping anti-pads
Kostka, D., Scogna, A. C., Jianmin Zhang, Qiu, K., Brooks, R.
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding