Design of a Low Phase Noise VCO for Rubidium Atomic Frequency Standard
Ju, Qingyun, Li, Xinwei, Ji, Lei, Tang, Liang, Qiao, Donghai
Published in MATEC Web of Conferences (01.01.2016)
Published in MATEC Web of Conferences (01.01.2016)
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Journal Article
Conference Proceeding
Parameter extraction of the coaxial resonator based on the SOLT calibration method
Qingyun Ju, Xinwei Li, Lei Ji, Liang Tang, Donghai Qiao
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
Published in 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) (01.06.2016)
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Conference Proceeding
Simulation of high-Q thin film bulk acoustic wave resonator for chip-scale atomic clock
Zhongshan Zhang, Menghui Zhi, Qingyun Ju, Liang Tang, Donghai Qiao
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
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Conference Proceeding
Design of a low phase noise voltage-controlled oscillator for chip-scale cesium atomic clock
Xinwei Li, Qingyun Ju, Lei Ji, Menghui Zhi, Liang Tang, Donghai Qiao
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
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Conference Proceeding
Optimization of the RF source for chip-scale cesium atomic clock
Lei Ji, Qingyun Ju, Menghui Zhi, Xinwei Li, Liang Tang, Donghai Qiao
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
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Conference Proceeding
Research on the electronics unit of digital fluxgate sensor
Menghui Zhi, Yongjian Lv, Lei Ji, Qingyun Ju, Liang Tang, Donghai Qiao
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
Published in 2016 IEEE International Nanoelectronics Conference (INEC) (01.05.2016)
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Conference Proceeding
Glove packaging system capable of bending thumb of glove and packaging method
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, JU CHENGXUAN, CUI YUSHEN, JU QIUBO, SUN ZHONGYUAN
Year of Publication 16.01.2024
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Year of Publication 16.01.2024
Patent
Pick-up packaging device and packaging method
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, JU CHENGXUAN, CUI YUSHEN, JU QIUBO, SUN ZHONGYUAN
Year of Publication 02.01.2024
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Year of Publication 02.01.2024
Patent
Glove packaging system capable of supplementing glove packaging number and packaging method
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, SUN ZHONGYUAN, CHOI SU-EUN
Year of Publication 02.07.2024
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Year of Publication 02.07.2024
Patent
Glove packaging system capable of supplementing glove packaging number
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, SUN ZHONGYUAN, CHOI SU-EUN
Year of Publication 25.06.2024
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Year of Publication 25.06.2024
Patent
Glove packaging system and method
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, SUN ZHONGYUAN, CHOI SU-EUN
Year of Publication 03.05.2024
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Year of Publication 03.05.2024
Patent
Glove packaging system
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, WANG YONGSHENG, CUI YUYUE, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, SUN ZHONGYUAN, CHOI SU-EUN
Year of Publication 27.10.2023
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Year of Publication 27.10.2023
Patent
Clamping device and glove packaging system capable of supplementing glove packaging number
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, SUN ZHONGYUAN, CHOI SU-EUN
Year of Publication 27.10.2023
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Year of Publication 27.10.2023
Patent
Demolding device and glove packaging system capable of supplementing glove packaging number
KURIU JUN, HE CHANGJUN, JU QINGYUN, WANG JUNNA, CUI YUYUE, WANG YONGSHENG, CUI YUQIN, JU CHENGXUAN, CUI YUSHEN, CHOI SU-EUN, SUN ZHONGYUAN
Year of Publication 17.10.2023
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Year of Publication 17.10.2023
Patent