Analysis of kinking in elastoplastic materials with strain-softening behavior
Zhang, Y.T., Qi, D.X., Gao, J., Huang, T.
Published in International journal of engineering science (01.11.2008)
Published in International journal of engineering science (01.11.2008)
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Analysis of phase transformation in orthotropic elastoplastic materials under tension and shear
Xie, Y.X., Zhang, Y.T., Qi, D.X., Cui, Y.H.
Published in Computational materials science (01.10.2008)
Published in Computational materials science (01.10.2008)
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Metal–organic chemical vapor deposited copper interconnects for deep submicron integrated circuits
Li, C.Y., Zhang, D.H., Lu, P.W., Su, S.S., Qi, D.X., He, X., Kumar, Rakesh, Balasubramanian, N.
Published in Thin solid films (03.01.2005)
Published in Thin solid films (03.01.2005)
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Barrier-free direct-contact-via (DCV) structures for copper interconnects
Li, C.Y., Zhang, D.H., Wu, J.J., Qi, D.X., Su, S.S., Qian, Y., Chow, Y.F., Koh, L.T., Foo, P.D.
Published in Electronics letters (29.08.2002)
Published in Electronics letters (29.08.2002)
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