Addressing sub-micron thermal warpage: Industrial application on semiconductor devices
Safia, Benkoula, Pierre, Vernhes, Nicolas, Choisel, Regis, Braisaz, Rodolfo, Cruz, Stephanie, Rey, Fabien, Quercia
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Copper wire in automotive: Key challenges and robust validation
Quercia, Fabien, Mancaleoni, Alberto
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding