Search Results - "QIU XIMAN" :: K.UTB vyhledávací portál

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Copper-based PCB circuit board containing thermoelectric separation copper boss and manufacturing method thereof

by QIU XIMAN
Year of Publication 01.01.2021

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Patent

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Manufacturing method of electroplated golden finger PCB (Printed Circuit Board)

by QIU XIMAN, TANG YONGQI
Year of Publication 04.10.2022

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Patent

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VCP clamp correction tool

by YUAN GUOLONG, QIU XIMAN
Year of Publication 19.01.2021

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Patent

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Viaonhole high-density circuit board

by QIU XIMAN, LI ZHIXIONG
Year of Publication 24.03.2023

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Patent

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PCB multilayer circuit board with counterbores

by QIU XIMAN, LI ZHIXIONG
Year of Publication 03.01.2023

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Patent

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High-density circuit board with in-plate holes

by QIU XIMAN, LI ZHIXIONG
Year of Publication 03.01.2023

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Patent

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High-heat-dissipation copper column composite metal-based PCB and preparation process thereof

by QIU XIMAN, CHEN ZHEN, ZHANG BENXIAN
Year of Publication 04.10.2022

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Patent

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3D interconnected high-density PCB

by QIU XIMAN, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 28.10.2022

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Patent

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Motor maintenance fixing clamp

by QIU XIMAN, LIU BAOYONG, REN LIUZHU
Year of Publication 01.12.2020

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Patent

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3D interconnected high-density PCB and manufacturing process thereof

by QIU XIMAN, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 10.05.2022

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Patent

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Jig for producing PCB (Printed Circuit Board) with embedded capacitor

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 30.12.2022

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Patent

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Environment-friendly false positive film PCB pattern manufacturing method based on laser imaging

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 01.11.2022

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Patent

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Micro-spacing SLP type carrier plate

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 28.10.2022

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Patent

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Multi-step PCB pressing jig

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 28.10.2022

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Patent

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Multi-step high-frequency PCB

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 28.10.2022

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Patent

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Method for optimizing design, reducing cost and increasing efficiency of multi-layer PCB (Printed Circuit Board)

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 04.10.2022

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Patent

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Glass-based Mini LED circuit board jig

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 20.09.2022

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Patent

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Manufacturing method of high-frequency PCB (Printed Circuit Board) with asymmetric stack-up design

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 09.09.2022

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Patent

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Ceramic-based PCB structure with embedded components

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 30.08.2022

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Patent

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Three-order HDI plate with embedded copper base

by QIU XIMAN, CHEN ZHEN, SHU ZHIQIAN, WEI HEPING, ZHANG BENXIAN, LI ZHIXIONG
Year of Publication 30.08.2022

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Patent

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